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  71308-5470 Datasheet PDF File

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    71308-5450 0713085450

Molex Electronics Ltd.
Part No. 71308-5450 0713085450
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 50 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 79425-470HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 70 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs 　 　

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HUA FENG CIRCUIT





    71308-5448 0713085448

Molex Electronics Ltd.
Part No. 71308-5448 0713085448
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 48 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB LocatorPegs
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 95547-050CAHLF
Description Assembly, Top Mount, S/D(68Pins), VTB, Type 123, 5V, 5mm s/o, Right Push Rod Eject, 8mm Card Travel
Tech specs 　 　

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    71308-5446 0713085446

Molex Electronics Ltd.
Part No. 71308-5446 0713085446
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 46 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 95547-050CALF
Description Assembly, Top Mount, S/D(68Pins), VTB, Type 123, 5V, 5mm s/o, Right Push Rod Eject, 8mm Card Travel
Tech specs 　 　

Official Product Page

    71308-5444 0713085444

Molex Electronics Ltd.
Part No. 71308-5444 0713085444
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 44 Circuits, 1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator Pegs
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 95547-040CALF
Description Assembly, Top Mount, S/D(68Pins), VTB, Type 123, 5V, 4.3mm s/o, Right Push Rod Eject, 8mm Card Travel
Tech specs 　 　

Official Product Page

    71308-5442 0713085442

Molex Electronics Ltd.
Part No. 71308-5442 0713085442
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 42 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 95547-020CALF
Description Assembly, Top Mount, S/D(68Pins), VTB, Type 123, 5V, 2.2mm s/o, Right Push Rod Eject, 8mm Card Travel
Tech specs 　 　

Official Product Page

    71308-5440 0713085440

Molex Electronics Ltd.
Part No. 71308-5440 0713085440
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 40 Circuits
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 68695-470HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Double Row, 70 Positions, 2.54mm Pitch, Right Angle, 5.84mm (0.23in) Mating, 2.29mm (0.09in) Tail.
Tech specs 　 　

Official Product Page

    71308-5438 0713085438

Molex Electronics Ltd.
Part No. 71308-5438 0713085438
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 38 Circuits, 1.50μm (59u) Minimum
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 10157547-0011SR1LF
Description Minitek® Multipitch™,1.25mm Crimp-to-Wire Connector Platform, Wire to Board Header, 11 Position, Top Latch, Tin (preplated)
Tech specs 　 　

Official Product Page

    0713086414 71308-6414

Molex Electronics Ltd.
Part No. 0713086414 71308-6414
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 14 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 10157547-0010SR1LF
Description Minitek® Multipitch™,1.25mm Crimp-to-Wire Connector Platform, Wire to Board Header, 10 Position, Top Latch, Tin (preplated)
Tech specs 　 　

Official Product Page

    71308-5432 0713085432

Molex Electronics Ltd.
Part No. 71308-5432 0713085432
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 32 Circuits, 1.50um (59u) Minimum
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 10157547-0003SR1LF
Description Minitek® Multipitch™,1.25mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position, Top Latch, Tin (preplated)
Tech specs 　 　

Official Product Page

    71308-5430 0713085430

Molex Electronics Ltd.
Part No. 71308-5430 0713085430
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 30 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 10157547-0013SR1LF
Description Minitek® Multipitch™,1.25mm Crimp-to-Wire Connector Platform, Wire to Board Header, 13 Position, Top Latch, Tin (preplated)
Tech specs 　 　

Official Product Page

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