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  71308-5470 Datasheet PDF File

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    0713086446 71308-6446

Molex Electronics Ltd.
Part No. 0713086446 71308-6446
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 46 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions
Part No. 79425-470HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 70 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs 　 　

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HUA FENG CIRCUIT





    0713086418 71308-6418

Molex Electronics Ltd.
Part No. 0713086418 71308-6418
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 18 Circuits, 1.50μm (59u) Minimum
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 95547-050CAHLF
Description Assembly, Top Mount, S/D(68Pins), VTB, Type 123, 5V, 5mm s/o, Right Push Rod Eject, 8mm Card Travel
Tech specs 　 　

Official Product Page

    0713086440 71308-6440

Molex Electronics Ltd.
Part No. 0713086440 71308-6440
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 40 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 95547-050CALF
Description Assembly, Top Mount, S/D(68Pins), VTB, Type 123, 5V, 5mm s/o, Right Push Rod Eject, 8mm Card Travel
Tech specs 　 　

Official Product Page

    0713086442 71308-6442

Molex Electronics Ltd.
Part No. 0713086442 71308-6442
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 42 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions
Part No. 95547-040CALF
Description Assembly, Top Mount, S/D(68Pins), VTB, Type 123, 5V, 4.3mm s/o, Right Push Rod Eject, 8mm Card Travel
Tech specs 　 　

Official Product Page

    713080150N

Molex Electronics Ltd.
Part No. 713080150N
Description 2.54mm Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 50 Circuits, 0.38μm Gold (Au) Selective Plating
File Size 26.96K  /  2 Page

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Amphenol Communications Solutions
Part No. 95547-020CALF
Description Assembly, Top Mount, S/D(68Pins), VTB, Type 123, 5V, 2.2mm s/o, Right Push Rod Eject, 8mm Card Travel
Tech specs 　 　

Official Product Page

    713084020N

Molex Electronics Ltd.
Part No. 713084020N
Description 2.54mm Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 20 Circuits, Tin (Sn) Plating, with 3.30mm PCB Locator Pegs
File Size 26.96K  /  2 Page

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Amphenol Communications Solutions
Part No. 68695-470HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Double Row, 70 Positions, 2.54mm Pitch, Right Angle, 5.84mm (0.23in) Mating, 2.29mm (0.09in) Tail.
Tech specs 　 　

Official Product Page

    713084016N

Molex Electronics Ltd.
Part No. 713084016N
Description 2.54mm Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 16 Circuits, Tin (Sn) Plating, with 3.30mm PCB Locator Pegs
File Size 27.03K  /  2 Page

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Amphenol Communications Solutions
Part No. 10157547-0011SR1LF
Description Minitek® Multipitch™,1.25mm Crimp-to-Wire Connector Platform, Wire to Board Header, 11 Position, Top Latch, Tin (preplated)
Tech specs 　 　

Official Product Page

    713084050N

Molex Electronics Ltd.
Part No. 713084050N
Description 2.54mm Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 50 Circuits, Tin (Sn) Plating, with 3.30mm PCB Locator Pegs
File Size 27.04K  /  2 Page

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Amphenol Communications Solutions
Part No. 10157547-0010SR1LF
Description Minitek® Multipitch™,1.25mm Crimp-to-Wire Connector Platform, Wire to Board Header, 10 Position, Top Latch, Tin (preplated)
Tech specs 　 　

Official Product Page

    0713085424

Molex Electronics Ltd.
Part No. 0713085424
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 24 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 10157547-0003SR1LF
Description Minitek® Multipitch™,1.25mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position, Top Latch, Tin (preplated)
Tech specs 　 　

Official Product Page

    0713085422

Molex Electronics Ltd.
Part No. 0713085422
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 22 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 10157547-0013SR1LF
Description Minitek® Multipitch™,1.25mm Crimp-to-Wire Connector Platform, Wire to Board Header, 13 Position, Top Latch, Tin (preplated)
Tech specs 　 　

Official Product Page

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