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  73780-3245 Datasheet PDF File

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    0737803244 73780-3244

Molex Electronics Ltd.
Part No. 0737803244 73780-3244
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 14.00mm (.551), Pin Length 3.00mm (.118),
File Size 198.71K  /  3 Page

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Amphenol Communications Solutions
Part No. 10132450-0611GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 6 Positions, GW Compatible PA9T, Tray packing.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    73780-3864 0737803864

Molex Electronics Ltd.
Part No. 73780-3864 0737803864
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 14.00mm (.551), Pin Length 4.00mm (.157),
File Size 201.55K  /  3 Page

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Amphenol Communications Solutions
Part No. 10132450-0811GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 8 Positions, GW Compatible PA9T, Tray packing.
Tech specs 　 　

Official Product Page

    0737802245

Molex Electronics Ltd.
Part No. 0737802245
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 15.00mm (.591), Pin Length 3.00mm (.118),
File Size 198.96K  /  3 Page

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Amphenol Communications Solutions
Part No. 10132450-0211GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 2 Positions, GW Compatible PA9T, Tray packing.
Tech specs 　 　

Official Product Page

    0737802247

Molex Electronics Ltd.
Part No. 0737802247
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 17.00mm (.669), Pin Length 3.00mm (.118),
File Size 198.94K  /  3 Page

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Amphenol Communications Solutions
Part No. 10132450-0421GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 4 Positions, GW Compatible PA9T, Tray packing.
Tech specs 　 　

Official Product Page

    0737802244

Molex Electronics Ltd.
Part No. 0737802244
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 14.00mm (.551), Pin Length 3.00mm (.118),
File Size 198.96K  /  3 Page

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Amphenol Communications Solutions
Part No. 10132450-1211GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 12 Positions, GW Compatible PA9T, Tray packing.
Tech specs 　 　

Official Product Page

    0737802243

Molex Electronics Ltd.
Part No. 0737802243
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 13.00mm (.512), Pin Length 3.00mm (.118),
File Size 198.96K  /  3 Page

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Amphenol Communications Solutions
Part No. 86832-454HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 54 Positions, 2.54 mm Pitch, Vertical, 8.26 mm (0.325 in.) Mating, 2.54 mm (0.1 in.) Tail.
Tech specs 　 　

Official Product Page

    73780-0144 0737800144

Molex Electronics Ltd.
Part No. 73780-0144 0737800144
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 14.00mm (.551), Pin Length 3.00mm (.118),
File Size 201.76K  /  3 Page

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Amphenol Communications Solutions
Part No. 10132450-1821GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 18 Positions, GW Compatible PA9T, Tray packing.
Tech specs 　 　

Official Product Page

    73780-0123 0737800123

Molex Electronics Ltd.
Part No. 73780-0123 0737800123
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits, Mounted Height 13.00mm (.512), Pin Length 2.50mm (.098),Solder Tail
File Size 201.99K  /  3 Page

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Amphenol Communications Solutions
Part No. 10132450-1411GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 14 Positions, GW Compatible PA9T, Tray packing.
Tech specs 　 　

Official Product Page

    73780-0147 0737800147

Molex Electronics Ltd.
Part No. 73780-0147 0737800147
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits
File Size 201.79K  /  3 Page

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Amphenol Communications Solutions
Part No. 10132450-0221GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 2 Positions, GW Compatible PA9T, Tray packing.
Tech specs 　 　

Official Product Page

    73780-0153 0737800153

Molex Electronics Ltd.
Part No. 73780-0153 0737800153
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits
File Size 202.01K  /  3 Page

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Amphenol Communications Solutions
Part No. 86832-456HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 56 Positions, 2.54 mm Pitch, Vertical, 8.26 mm (0.325 in.) Mating, 2.54 mm (0.1 in.) Tail.
Tech specs 　 　

Official Product Page

For 73780-3245 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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