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| ZMD-Standard February 2000 Package SSOP16 (5,3 mm) Dimensions in millimetres Based on JEDEC JEP95: MO-150 1 Dimensions X MDS 753 Supersedes Edition 06.98 A2 View X A k x 45 16 0,1 A1 Z 1 e D bp 0,15 M Dimensions of Sub-Group B1 Amax bPmin bPmax enom HEmin HEmax LPmin Zmax 2 Weight 3 Package Body Material 4 Lead Material 5 Lead Finish 6 Lead Form 0,3 g Low Stress Epoxy FeNi-Alloy or Cu-Alloy solder plating Z-bends 1,99 0,25 0,38 0,65 7,65 7,90 0,63 0,89 HE E Dimensions of Sub-Group C1 Amin A1min A1max A2min A2max cmin cmax Dmin* Dmax* Emin* Emax* kmin qmin qmax 1,73 0,05 0,21 1,68 1,78 0,09 0,20 6,07 6,33 5,20 5,38 0,25 0 10 * without mold-flash Zentrum Mikroelektronik Dresden AG Editor: signed Schoder Check: signed Marx Date: 30.03.1998 Quality: signed Lorenz Doc-No. QS-000753-HD-02 c LP G |
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