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| Datasheet File OCR Text: |
| Effect of PWB Copper Area on Thermal Performance of 20-Lead SOIC LB Package Thermal Resistance (RJA) vs. Copper Area on PWB 100 Thermal Resistance (0C/W) One side Copper Two side Copper 90 80 70 60 50 40 0 1 2 3 4 Area of Copper on Board (in2) Variable Copper Area Test Board Red-hatched area is copper on the surface of the PWB Copper Area Must Be Connected to Package Ground Leads The 20 lead LB package has 4 ground leads as shown. Additional copper area must be connected to these leads. 16 15 5 6 Using a Double-Layer PWB For the double-layer copper board, the copper area on the bottom is identical to the area on the top. Both the top and bottom layers are thermally connected through vias placed on each ground lead. |
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