| PART |
Description |
Maker |
| MOC213M |
8-Pin SOIC Phototransistor Output Optocoupler; Package: SOIC-W; No of Pins: 8; Container: Box
|
FAIRCHILD SEMICONDUCTOR CORP
|
| ATS060060013-PF-16L |
60.00 x 60.00 x 13.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS028028013-PF-9L |
28.00 x 28.00 x 13.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS031031005-PF-10D |
31.00 x 31.00 x 5.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin FIn
|
Advanced Thermal Solutions, Inc.
|
| ATS031031018-PF-10Q |
31.00 x 31.00 x 18.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS015015013-PF-4L |
15.00 x 15.00 x 13.00 mm BGA Heat Sink (HIgh Aspect Ratio Ext.) Custom Pin FIn
|
Advanced Thermal Solutions, Inc.
|
| ATS019019007-PF-6F |
19.00 x 19.00 x 7.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS014014005-PF-3D |
14.00 x 14.00 x 5.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin FIn
|
Advanced Thermal Solutions, Inc.
|
| ATS024024009-PF-8H |
24.00 x 24.00 x 9.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS024024003-PF-8B |
24.00 x 24.00 x 3.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
