| PART |
Description |
Maker |
| IBM13M32734BCA |
32M x 72 2-Bank Registered SDRAM Module(32M x 72 2组寄存同步动态RAM模块) 32M × 72配置2，银行注册内存模块（32M × 72配置2组寄存同步动态内存模块）
|
International Business Machines, Corp.
|
| LRS1380J |
STACKED CHIP 32M (X 16) BOOT BLOCK FLASH AND 4M (X 16) SRAM
|
Sharp Electrionic Components
|
| LRS1383H |
STACKED CHIP 32M (X 16) BOOT BLOCK FLASH AND 8M (X 16) SRAM
|
Sharp Electrionic Components
|
| HYS64V32300GU HYS72V32300GU |
3.3 V 32M × 64-Bit SDRAM Module(3.3 V 32M × 64同步动态RAM模块)
3.3 V 32M × 72-Bit SDRAM Module(3.3 V 32M × 72同步动态RAM模块)
|
SIEMENS AG
|
| DL5224 DL5279 DL5267 DL5243 DL5226 DL5242 DL5223 |
Terminal Block; Number of Positions:2; Wire Size (AWG):14-2; Number of Contacts:2; Terminal Block Clamp Type:Power Block Splicer
RES 499K-OHM 0.1% 0.25W 25PPM THIN-FILM SMD-1206 TR-7-PA ROHS
surface mount silicon Zener diodes 13 V, 0.5 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE
RES 49.9K-OHM 0.1% 0.25W 25PPM THIN-FILM SMD-1206 TR-7-PA ROHS 180 V, 0.5 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE
Terminal Block; Number of Positions:2; Number of Contacts:2; Terminal Block Clamp Type:Power Stud Block
|
Micro Commercial Components Corp.
Micro Commercial Components, Corp.
|
| W3H32M72E-667ES W3H32M72E-667ESM W3H32M72E-667ESI |
32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package 32M × 72配置DDR2 SDRAM08 PBGA封装多芯片封
|
Atmel, Corp.
Honeywell International, Inc.
|
| LPCIE-7230 |
32-CH Isolated DIO Cards
|
List of Unclassifed Manufacturers
|
| 2-1437720-7 |
T01 CABLE CONNECTION MALE-FEMALE PLUG 4 POS. 1-32m T01 VERBINDUNGSKABEL STIFT-BUCHSE 4 POL. 1-32m
|
Tyco Electronics
|
| TC58NS256DC |
TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS 256-MBIT (32M ?8 BITS) CMOS NAND E2PROM (32M BYTE SmartMediaTM)
|
TOSHIBA[Toshiba Semiconductor]
|
| KM23C32101C |
32M-Bit (4Mx8) CMOS MASK ROM(32M(4Mx8) CMOS掩膜ROM)
|
SAMSUNG SEMICONDUCTOR CO. LTD.
|
