| PART |
Description |
Maker |
| GBAV70 |
consists of two diodes in a plastic surface mount
|
GTM CORPORATION
|
| 1MC10-071-10 1MC10-071-15 1MC10-071-20 1MC10071 |
Thermoelectric Module
The MC10 is powered sub-series of large MC series of TE micro-modules. It consists of the following TEC types
|
RMT Ltd.
|
| 16215 16215BNMET12 16215BNMST12 16215BNFST12 16215 |
16 Character by 2 Line Alphanumeric LCD Assembly With COG Controller No internal backlight assembly 16字符2行点阵式液晶大会通过焦炉煤气控制器无内部背光板装
|
Electronic Theatre Controls, Inc.
|
| 2200162 |
Plug-in assembly reduces assembly time and therefore saves costs
|
PHOENIX CONTACT
|
| HEDS-5500 HEDS-5540 HEDS-5505-A14 HEDS5540 HEDM-55 |
HEDL-5561#J06 · Encoder Line Drivers
HEDS-5540#A01 · Quick Assembly Two and Three Channel Optical Encoder
HEDS-5140#A02 · Two and Three Channel Codewheels
HEDS-5505#A04 · Quick Assembly Two and Three Channel Optical Encoder
HEDM-5505#B04 · Quick Assembly Two and Three Channel Optical Encoder
HEDS-5600#A06 · Quick Assembly Two and Three Channel Optical Encoder
HEDS-5500#A01 · Quick Assembly Two and Three Channel Optical Encoder
HEDM-5605#B06 · Quick Assembly Two and Three Channel Optical Encoder
HEDM-5600#B06 · Quick Assembly Two and Three Channel Optical Encoder
HEDS-5120#A01 · Two and Three Channel Codewheels
HEDM-5120#B02 · Two and Three Channel Codewheels
HEDM-5500#B01 · Quick Assembly Two and Three Channel Optical Encoder
HEDS-8910#001 · Alignment Tool For The 3-channel Quick Assembly Encoders HEDS-554X/564X Series
Quick Assembly Two and Three Channel Optical Encoders
|
Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
|
| MR18R162GAF0 MR16R162GAF0 MR18R1624AF0 MR18R1622AF |
64M X 16 RAMBUS MODULE, DMA184
TVS 500W 6.5V BIDIRECT DO-15 6Mx16显示）2/8/16）件RIMM的模块，基于256Mb阿芯片，32秒银行，16K/32ms参考，.5V
16Mx16显示）2/8/16）件RIMM的模块，基于256Mb阿芯片，32秒银行，16K/32ms参考，.5V
(MR18R1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
(MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
|
| IRLC1304 2299 |
HEXFET Power MOSFET Die in Wafer Form(晶圆形式的HEXFET 功率MOS场效应管)
From old datasheet system
HEXFET? Power MOSFET Die in Wafer Form
|
International Rectifier
|
| 1008001P 1008001S 1008003P 1008003S |
OUTLINE ASSEMBLY-MARC SHIELDED PIN&SOCKET CONTACTS
PIN CONTACT ASSEMBLY
|
Winchester Electronics ...
|
| MURC520 |
MURC520 Ultrafast Silicon Die
MURC520 Ultrafast Silicon Die
|
Sensitron
|
| MURC620 |
MURC620 Ultrafast Silicon Die
MURC620 Ultrafast Silicon Die
|
http://
|
| X76F128HG-2.7 X76F128HE-2.7 X76F128HEG-2.7 |
16K X 8 FLASH 2.7V PROM, UUC ROHS COMPLIANT, DIE
16K X 8 FLASH 2.7V PROM, UUC DIE
|
IC MICROSYSTEMS Sdn. Bhd.
|
