| PART |
Description |
Maker |
| 280-012H3C 280-012H1C 280-012H2C 280-012K5C 280-01 |
Rear Printed Circuit Board Termination Glass-Sealed D-Subminiature Connector
|
Glenair, Inc.
|
| BM-10EG57ND |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
5X7 DOT MATRIX DISPLAY, HIGH EFFICIENCY RED/YELLOW GREEN, 30.48 mm
|
BRIGHT LED ELECTRONICS CORP
AMERICAN BRIGHT OPTOELECTRONICS CORP
|
| W3NRD0T-0200-X |
GaN Substrate Products
|
CREE[Cree, Inc]
|
| NSL-4132 |
TO-18 Photocells Ceramic Substrate 8光电池陶瓷基
|
Silonex, Inc.
|
| VCS1003A |
PCB Substrate for excellent TCE match
|
CTS Corporation
|
| EM44GS28-32.768K-2.5-30 EM44GS3-32.768K-2.5-30 VEM |
Clipped Sinewave, 4 Pad FR4 substrate SMD
|
EUROQUARTZ limited
|
| BD-A304ND |
hi-eff red chips, GaAsP on GaP substrate
|
BRIGHT LED ELECTRONICS CORP
|
| T488R227M004AAE2K0 |
Small Case Size Substrate Terminal MnO2
|
Kemet Corporation
|
| BD-C403ND |
yellow chips, which are made from GaAsP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| BD-E522RD |
green CHIPS, WHICH ARE MADE FROM GAAIAS ON GAP substrate
|
BRIGHT LED ELECTRONICS CORP
|
