| PART |
Description |
Maker |
| CBR06C300FAGAC |
Ceramic, High Q, Microwave (CBR), 30 pF, 1%, 250 V, 0603, C0G, SMD, Fixed, RF, Ultra High Q, Low ESR, Class I
|
Kemet Corporation
|
| CBR04C200F5GAC |
Ceramic, High Q, Microwave (CBR), 20 pF, 1%, 50 V, 0402, C0G, SMD, Fixed, RF, Ultra High Q, Low ESR, Class I
|
Kemet Corporation
|
| CBR04C220J5GAC |
Ceramic, High Q, Microwave (CBR), 22 pF, 5%, 50 V, 0402, C0G, SMD, Fixed, RF, Ultra High Q, Low ESR, Class I
|
Kemet Corporation
|
| AQ137M3R3CA7ME AQ12EM110FAJWE |
CAP 3.3PF 500V .25PF PORC- 9030PPM SMD-1111 TR-7 MICROWAVE CAPACITOR, CERAMIC, MULTILAYER, 500 V, 0.0000033 uF, SURFACE MOUNT
CAP 11PF 150V 1% PORC- 9030PPM SMD-0505 WAFFLE-PAK MICROWAVE CAPACITOR, CERAMIC, MULTILAYER, 150 V, 0.000011 uF, SURFACE MOUNT
|
AVX, Corp.
|
| CK-L09505M521 CK-L09505D521 CK-L09623M511 CK-R2273 |
9250 MHz - 9750 MHz RF/MICROWAVE ISOLATOR
8400 MHz - 10700 MHz RF/MICROWAVE ISOLATOR
21200 MHz - 24200 MHz RF/MICROWAVE ISOLATOR
3400 MHz - 3500 MHz RF/MICROWAVE ISOLATOR
3600 MHz - 4200 MHz RF/MICROWAVE ISOLATOR
5800 MHz - 7200 MHz RF/MICROWAVE ISOLATOR
4300 MHz - 5100 MHz RF/MICROWAVE ISOLATOR
17300 MHz - 19700 MHz RF/MICROWAVE ISOLATOR
|
FDK CORP
|
| SD1528-08 2824 1528-8 |
From old datasheet system
RF & MICROWAVE TRANSISTORS AVIONICS APPLICATIONS
ECON FO CERAMIC 62.5 PVC ST/LC 2M
|
STMICROELECTRONICS[STMicroelectronics]
ST Microelectronics
意法半导
|
| CW201212-R33J CW201212-12NJ CW201212-R56J CW201212 |
MAGNETICS-HIGH Q CHIP INDUCTOR 1 ELEMENT, 0.33 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
MAGNETICS-HIGH Q CHIP INDUCTOR 1 ELEMENT, 0.012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
MAGNETICS-HIGH Q CHIP INDUCTOR 1 ELEMENT, 0.56 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
MAGNETICS-HIGH Q CHIP INDUCTOR 1 ELEMENT, 0.91 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
MAGNETICS-HIGH Q CHIP INDUCTOR 1 ELEMENT, 0.0033 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Inductor; Inductor Type:High Frequency; Inductance:13.3nH; Inductance Tolerance: /- 5 %; Current Rating:600mA; Series:CW201212; Package/Case:0805; Core Material:Alumina Ceramic; Leaded Process Compatible:Yes RoHS Compliant: Yes
|
Bourns, Inc.
BOURNS INC
|
| RFP-250-50TC |
0 MHz - 3000 MHz 50 ohm RF/MICROWAVE TERMINATION ALUMINA CERAMIC, FM-1
|
Anaren, Inc.
|
| RFP-150-50TCGF |
0 MHz - 2000 MHz 50 ohm RF/MICROWAVE TERMINATION CERAMIC PACKAGE-1
Flanged Terminations
|
Anaren, Inc.
Anaren Microwave
|
| RFP-60-50TPC |
0 MHz - 6000 MHz 50 ohm RF/MICROWAVE TERMINATION CERAMIC PACKAGE-1
Flanged Terminations
|
Anaren, Inc.
Anaren Microwave
|
| BMC0805HF-R27K BMC BMC0402HF-10NK BMC0402HF-12NK B |
1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.056 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.001 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.0033 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Surface Mount Multilayer High Frequency Ceramic Chip Inductors 0402 - 0805 Industry Sizes
1 ELEMENT, 0.1 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
BITECH[Bi technologies]
BI Technologies Corporation
|
|
