| PART |
Description |
Maker |
| AQW654 AQW654A |
Both 1 Form A and 1 Form B contacts incorporated in a compact DIP8-pin with low on-resistance
|
Panasonic Semiconductor
|
| FTR-B2NA4.5Z FTR-B2 FTR-B2MA012Z FTR-B2MA4.5Z FTR- |
4 POLE (2 FORM C 2 FORM A) SIGNAL RELAY FOR CENTRAL SWITCHING/ DATA TRANSMISSION
|
Fujitsu Limited
Fujitsu Microelectronics
FUJITSU[Fujitsu Media Devices Limited]
Fujitsu Component Limited.
|
| FSD20A90 |
Miniature Power Relay, 1 Form A 1 Form B, 10A 250VAC 10A 30VDC, 2 Coil Latching 20 A, 900 V, SILICON, RECTIFIER DIODE
|
Nihon Inter Electronics, Corp.
|
| 3-1419108-9 3-1419108-6 3-1419108-1 RT314024F 5-14 |
Power PCB Relay RT1
5kV/10mm coil-contact, reinforced insulation
1 pole 12A/16A, 1 form C (CO) or 1 form A (NO) contact
|
Tyco Electronics
TE Connectivity Ltd
|
| B40C5000-300006 B80C5000-3000 B380C5000-3000 B125C |
Polarized Power Relay, 1 Form A 1 Form B, 8A 250VAC 5A 30VDC, 1 Coil Latching 3.5 A, 160 V, SILICON, BRIDGE RECTIFIER DIODE
Silicon-Bridge Rectifiers
|
Semikron International
|
| EBD26UC6AKSA-E EBD26UC6AKSA-6B-E EBD26UC6AKSA-7A-E |
Single Pole Normally Open: 1-Form-A, 400V
Single Pole Normally Open: 1-Form-A, 600V
256MB DDR SDRAM SO-DIMM (32M words x 64 bits, 2 Ranks)
|
Elpida Memory, Inc.
ELPIDA[Elpida Memory]
|
| IRG4CC50WB |
IGBT Die in Wafer Form 600 V Size 5 WARP Speed
IRG4CC50WB IGBT Die in Wafer Form
|
Hittite Microwave Corporation
International Rectifier
|
| EVALPAN1322 |
All-In-One, Place and Play Bluetooth Module
|
Panasonic Semiconductor
|
| CCM01-1NF |
SNAP IN BOARDLOCKS HOLD THE CONNECTOR IN PLACE PRIOR TO SOLDERING.
|
ITT Industries
|
| 50-00028 |
20802 Sockeye Place #130 Bend, OR 97701 USA
|
Tensility International Corp.
|
| 806-22-001-10-002191 |
Spring-Loaded Pin with Removable Pick and Place Cap
|
Mill-Max Mfg. Corp.
|
