| PART |
Description |
Maker |
| RM-8 |
8-Lead Mini Small Outline Package [MSOP] Dimensions shown in millimeters
|
Analog Devices
|
| SOGC200133K0GDC399 |
SOGC 01, 03, 05 Thick Film Resistor Networks, Dual-In-Line, Wide Body, Small Outline, Molded DIP, Surface Mount
|
Vishay Dale
|
| 081029132723 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| DFN1006-2 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| 369A-13 |
MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS
|
ONSEMI[ON Semiconductor]
|
| TO247 TO247AC TO247C |
HEXFET TO-247AC Outline Dimensions are shown in millimeters (inches)
|
Electronic Theatre Controls, Inc.
ETC[ETC]
List of Unclassifed Manufacturers
|
| 21-0108 |
PACKAGE OUTLINE, TSSOP 4.4MM BODY, EXPOSED PAD
|
Maxim Integrated Products
|
| HYM328000GD-60 HYM328000GD- 328000 HYM328000GD-50 |
-8M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE
8M x 32 Bit DRAM Module (SO-DIMM)
From old datasheet system
8M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE 8M X 32 FAST PAGE DRAM MODULE, 60 ns, ZMA72
|
Siemens Semiconductor G...
Infineon
SIEMENS[Siemens Semiconductor Group]
SIEMENS AG
|
| MOCD207 |
Super Small Outline
|
ISOCOM COMPONENTS
|
| TSSOP MSOP TSSOP-EP MSOP-EP |
SMALL OUTLINE PACKAGES
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| MT4LDT464HX |
SMALL-OUTLINE DRAM MODULE
|
Micron Technology, Inc.
|
| FDG6322C |
Very small package outline SC70-6.
|
TY Semiconductor Co., L...
|
