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B772S -    TO-92 Plastic-Encapsulate Transistors

B772S_8842586.PDF Datasheet

 
Part No. B772S
Description    TO-92 Plastic-Encapsulate Transistors

File Size 678.69K  /  5 Page  

Maker

Jiangsu Changjiang Elec...



JITONG TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor

Part: B772
Maker: NEC
Pack: TO-126
Stock: 434
Unit price for :
    50: $0.11
  100: $0.10
1000: $0.10

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ETC[ETC]
List of Unclassifed Manufacturers
2-130014-1 PLASTI-GRIP TERMINAL WIRE SIZE : 22-16 AWG
Tyco Electronics
71349-1052 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, Shrouded40 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, without Press-fit Plasti
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Molex Electronics Ltd.
71349-1056 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, Shrouded48 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, without Press-fit Plasti
Molex Electronics Ltd.
0877159309 1.00mm (.039) Pitch, PCI Express* Connector, 164 Circuits, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.76μm (30μ) Gold (Au) Plating, with Plastic Pegs
1.00mm (.039) Pitch, PCI Express* Connector, 164 Circuits, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.76楼矛m (30楼矛) Gold (Au) Plating, with Plasti
Molex Electronics Ltd.
47505-4305 0475054305 1.00mm (.039") Pitch, PCI Express* Connector, 164 Circuits, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.38渭m (15渭") Gold (Au) Plating, with Plasti
1.00mm (.039) Pitch, PCI Express* Connector, 164 Circuits, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.38μm (15μ) Gold (Au) Plating, with Plastic Pegs
Molex Electronics Ltd.
 
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