| PART |
Description |
Maker |
| MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
| SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
| TO92 |
Through hole, 3 pin package Package outline
|
Zetex Semiconductors
|
| DFN2X2-10 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN4X4-16 |
Package Outline
|
Global Mixed-mode Techn...
|
| WDFN2X2-8 |
Package Outline
|
Global Mixed-mode Techn...
|
| LQFP44 |
Package outline
|
Philips
|
| SOT223 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOD882 |
Package outline
|
STANFORD[Stanford Microdevices]
|
| TSSOP-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-14 |
Package Outline
|
Global Mixed-mode Techn...
|