| PART |
Description |
Maker |
| MIC2104YML MIC2103 MIC2103YML |
75V, Synchronous Buck Controllers featuring Adaptive On-Time Control
|
Micrel Semiconductor
|
| TWR-PXR40 |
32-bit Power Architecture? MCU for High-Performance Real-Time Applications
|
Freescale Semiconductor, Inc
|
| MIC217410 MIC2174-1YMM MIC2174-1YMMTR MIC2174C-1YM |
Synchronous Buck Controller Featuring Adaptive On-Time Control 40V Input, 300kHz SWITCHING CONTROLLER, 375 kHz SWITCHING FREQ-MAX, PDSO10 LEAD FREE, MSOP-10
|
Micrel Semiconductor, Inc.
|
| M5LV-512/256-10SAI M5LV-512/256-12SAC M5LV-256/160 |
EE PLD, 10 ns, PBGA352 BGA-352 EE PLD, 12 ns, PBGA352 BGA-352 Fifth Generation MACH Architecture EE PLD, 10 ns, PQFP208 Fifth Generation MACH Architecture EE PLD, 12 ns, PQFP208 Fifth Generation MACH Architecture EE PLD, 20 ns, PQFP160 Fifth Generation MACH Architecture EE PLD, 5.5 ns, PQFP100 Fifth Generation MACH Architecture EE PLD, 15 ns, PQFP160 Fifth Generation MACH Architecture EE PLD, 10 ns, PQFP160 EE PLD, 15 ns, PBGA352 BGA-352 Fifth Generation MACH Architecture EE PLD, 5.5 ns, PQFP144 EE PLD, 15 ns, PQFP160 PLASTIC, QFP-160 CONNECTOR ACCESSORY EE PLD, 5.5 ns, PQFP100 Fifth Generation MACH Architecture EE PLD, 15 ns, PQFP208 Fifth Generation MACH Architecture EE PLD, 7.5 ns, PQFP208 Fifth Generation MACH Architecture EE PLD, 10 ns, PQFP100 EE PLD, 15 ns, PQFP100 TQFP-100 Fifth Generation MACH Architecture EE PLD, 20 ns, PQFP208 EE PLD, 12 ns, PQFP100 TQFP-100 EE PLD, 12 ns, PBGA256 BGA-256
|
Lattice Semiconductor, Corp. LATTICE SEMICONDUCTOR CORP
|
| CY7C1474V33-167BGC CY7C1470V33-250AXC CY7C1470V33- |
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL Architecture ECONOLINE: RQS & RQD - 1kVDC Isolation- Internal SMD Construction- UL94V-0 Package Material- Toroidal Magnetics- Efficiency to 80% 72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL Architecture 4M X 18 ZBT SRAM, 3 ns, PBGA165 72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL Architecture 4M X 18 ZBT SRAM, 3.4 ns, PBGA165 72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL Architecture 1M X 72 ZBT SRAM, 3.4 ns, PBGA209 72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL Architecture 2M X 36 ZBT SRAM, 3.4 ns, PBGA165
|
Cypress Semiconductor Corp. Cypress Semiconductor, Corp.
|
| BBS-15 BBS-1/4 BBS-2/10 BBS-1-8/10 BBS-10 BBS-1-6/ |
72-Mbit QDR-II SRAM 2-Word Burst Architecture 72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL Architecture 72-Mbit DDR-II SRAM 2-Word Burst Architecture 72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL Architecture 36-Mbit QDR-II SRAM 4-Word Burst Architecture Fuse 256K (32K x 8) Static RAM 64/256/512/1K/2K/4K x 18 Synchronous FIFOs Low-Voltage 64/256/512/1K/2K/4K/8K x 9 Synchronous FIFOs Neuron® Chip Network Processor 64-Kbit (8K x 8) Static RAM 72-Mbit QDR™-II SRAM 2-Word Burst Architecture 保险
|
NXP Semiconductors N.V.
|
| CAT64LC20ZS CAT64LC20ZP CAT64LC20J-TE7 CAT64LC20J- |
36-Mbit QDR-II SRAM 4-Word Burst Architecture 36-Mbit QDR-II SRAM 2-Word Burst Architecture 9-Mbit (256K x 36/512K x 18) Pipelined SRAM with NoBL Architecture 4-Mbit (128K x 36) Pipelined SRAM with NoBL Architecture 4-Mbit (128K x 36) Flow-through SRAM with NoBL Architecture 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM with NoBL Architecture SPI Serial EEPROM SPI串行EEPROM 36-Mbit QDR™-II SRAM 2-Word Burst Architecture SPI串行EEPROM 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM SPI串行EEPROM 256K (32K x 8) Static RAM SPI串行EEPROM
|
Analog Devices, Inc. Electronic Theatre Controls, Inc.
|
| CY7C1515KV18-250BZXI CY7C1515KV18-300BZC CY7C1515K |
72-Mbit QDR II SRAM 4-Word Burst Architecture 72-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V 4M X 18 QDR SRAM, 0.45 ns, PBGA165
|
http:// Cypress Semiconductor, Corp.
|
| AM29L516DC AM29L517DC AM29L517AXC AM29L517/BXC AM2 |
Dimming Ballast Control, Brown-out Protection, Programmable Preheat Time, 1.8us Deadtime in a 16-lead SOIC Narrow package; A IR21593S with Standard Dimming Ballast Control, Brown-out Protection, Programmable Preheat Time, 1.8us Deadtime in a 16-lead SOIC Narrow package; A IR21592S with Tape Dimming Ballast Control, Brown-out Protection, Programmable Preheat Time, 1.8us Deadtime in a 16-lead SOIC Narrow package; A IR21592S with Standard Half Bridge Driver, LO In Phase with RT, Programmable Oscillating Frequency, 0.6us Deadtime in a 8-lead SOIC package and different phase; Similar to IR21531S with Lead Free Packaging Hi-Rel DC-DC Standard Dual Converter in a ATR package; A ATR2815D with Standard Packaging Ballast Control, Programmable Preheat Time and Run Frequency, Programmable Deadtime in a 14-pin DIP package; A IR2156 with Standard Packaging Hi-Rel DC-DC Standard Triple Converter in a ATR package; A ATR2815T with Standard Packaging Hi-Rel DC-DC Rad-Hard Triple Converter in a ART package; A ART2812T with Standard Packaging 600V Ballast Controller IC with Adaptive Zero-Voltage Switching, Internal Crest Factor Over-Current Protection and an Integrated Bootstrap Diode in a 8-Pin SOIC package.; Similar to IR2520DS with Lead Free Packaging Multiplier 乘数
|
Rochester Electronics, LLC
|
| CY7C1514KV18 CY7C1514KV18-300BZXC CY7C1512KV18-300 |
72-Mbit QDR II SRAM 2-Word Burst Architecture Two-word burst on all accesses 72-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V 2M X 36 QDR SRAM, 0.45 ns, PBGA165 72-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V 4M X 18 QDR SRAM, 0.45 ns, PBGA165
|
Cypress Semiconductor, Corp.
|
| CY7C1518KV18-300BZXC |
72-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V 4M X 18 DDR SRAM, 0.45 ns, PBGA165
|
Cypress Semiconductor, Corp.
|
| CY7C1518JV18-250BZC CY7C1518JV18-300BZXC |
72-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V 4M X 18 DDR SRAM, 0.45 ns, PBGA165
|
Cypress Semiconductor, Corp.
|
|