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YR292-B5538 - 2U High-Density and Power-Efficient Platform for VHD/VDI Applications

YR292-B5538_8303807.PDF Datasheet


 Full text search : 2U High-Density and Power-Efficient Platform for VHD/VDI Applications
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ISOPAC01 ISOPAC0103 ISOPAC0104 ISOPAC0111 ISOPAC01 High Current High density Isolated Silicon Power Rectifier(????靛?600V锛?ぇ?垫?锛??瀵?害锛??绂诲?锛??????存???
High Current High density Isolated Silicon Power Rectifier(????靛?1000V锛?ぇ?垫?锛??瀵?害锛??绂诲?纭?????娴??)
High-Current Isolated Rectifier Assemblies. 150 V-1000 V. 10 nS - 2 microseconds 大电流隔离整流器大会150 V000五,10纳秒- 2微秒
HIGH CURRENT ISOLATED RECTIFIER ASSEMBLY
High Current High density Isolated Silicon Power Rectifier(????靛?1000V锛?ぇ?垫?锛??瀵?害锛??绂诲?锛??????存???
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MCN51-8S3-PFA MCN51-16P2-DS MCN51-16P2-PFA MCN51-1 CAP 0.1UF 50V 20% Z5U RAD.20 .20X.20 BULK 高电流,高密度,电源连接
16 Characters x 2 Lines, 5x7 Dot Matrix Character and Cursor 高电流,高密度,电源连接
High Current, High Density, Power Connectors 高电流,高密度,电源连接
High Current / High Density / Power Connectors
HIROSE ELECTRIC Co., Ltd.
Hirose Electric USA, INC.
HIROSE[Hirose Electric]
LTC3566 High Effi ciency USB Power Manager Plus 1A Buck-Boost Converter
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High Voltage,High Density Fast Recovery Rectifier(反向电压6000V,温5℃时平均整流电流1.5A,高压,高密度,快速恢复整流器)
High Voltage,High Density Fast Recovery Rectifier(反向电压12000V,温5℃时平均整流电流1.5A,高压,高密度,快速恢复整流器)
High Voltage,High Density Fast Recovery Rectifier(反向电压2000V,温5℃时平均整流电流1.5A,高压,高密度,快速恢复整流器)
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W4NRD0X-0000 W4NRD8C-U000 W4NXD8C-0000 W4NXD8C-L00 Diameter: 50.8mm; LCW substrates; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; ultra-low mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; standatd mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; low mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; select mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 76.2mm; LCW type; 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; LCW type; 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; lsemi-insulating (prototype); 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
CREE POWER
LTM4602HVIV-PBF LTM4602HVEV-PBF LTM4602HVV 6A, 28VIN High Effi ciency DC/DC μModule
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2.5V In-System Programmable SuperFASTHigh Density PLD EE PLD, 10 ns, PQFP44
LATTICE[Lattice Semiconductor]
LATTICE [Lattice Semiconductor]
Lattice Semiconductor Corporation
Lattice Semiconductor, Corp.
 
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