| PART |
Description |
Maker |
| 15-80-0089 0015800089 A-70567-0274 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Plat
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0065 0015800065 70567-0137 A-70567-0137 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plati
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0143 0015800143 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0063 0015800063 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plati
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| A-70567-0349 15-80-1221 0015801221 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
|
Molex Electronics Ltd.
|
| A-70567-0344 15-80-1121 0015801121 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0015800205 15-80-0205 70567-0144 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 15-47-7732 0015477732 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, 0.76渭m (30渭) Gold (Au) Selective Platin
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0015477634 15-47-7634 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 34 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 34 Circuits, 0.38渭m (15渭) Gold (Au) Selective Platin
|
Molex Electronics Ltd.
|
| 43045-0213 43045-0214 43045-0212 430450212 43045-1 |
MICRO FIT (3.0) DUAL ROW VERTICAL THRU HOLE HEADER ASSY
|
Molex Electronics Ltd.
|
| 87835-2442 0878352442 |
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 24 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
|
