| PART |
Description |
Maker |
| HX324C11SR-4 |
DDR3-2400 CL11 240-Pin DIMM
|
List of Unclassifed Man...
|
| HX324C11T2K2-8 |
DDR3-2400 CL11 240-Pin DIMM Kit
|
List of Unclassifed Man...
|
| M368L6423F M381L3223FTM M381L3223FTM-CLB3A2 M381L6 |
184pin Unbuffered Module based on 256Mb F-die with 64/72-bit Non-ECC / ECC
|
SANKEN[Sanken electric]
|
| M378T2953BGZ0-CD5_CC M378T2953BGZ3-CD5_CC M378T335 |
240pin Unbuffered Module based on 512Mb B-die 64/72-bit Non-ECC/ECC
|
Samsung Electronic SAMSUNG[Samsung semiconductor]
|
| HMD4M144D9WG-5 HMD4M144D9WG-6 HMD4M144D9WG |
64Mbyte(4Mx144) 200-pin ECC Mode 4K Ref. DIMM Design 5V
|
Hanbit Electronics Co.,Ltd
|
| V4374128C24V V4374128C24VXXG-10PC V4374128C24VXXG- |
1GB 168-PIN REGISTERED PLL ECC SDRAM DIMM 3.3 VOLT 128M x 72
|
Mosel Vitelic Corp MOSEL[Mosel Vitelic, Corp]
|
| 0702871037 |
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with Retention Pin, 78 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
|
Molex Electronics Ltd.
|
| IRPLDIM5E |
4 Level Switch Dim Fluorescent Ballast using the IRS2530D DIM8TM
|
International Rectifier
|
| 70287-1020 0702871020 |
2.54mm (.100) Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with Retention Pin, 44 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with Retention Pin, 44 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
|
Molex Electronics Ltd.
|
| 70287-1022 0702871022 |
2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with Retention Pin, 48 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with Retention Pin, 48 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
|
Molex Electronics Ltd.
|