| PART |
Description |
Maker |
| ICPL2630-12 ICPL2631 |
DESCRIPTION
|
ISOCOM COMPONENTS
|
| APM2301AAC-TRL |
PIN DESCRIPTION
|
TY Semiconductor Co., Ltd
|
| SGF5N150UF |
GENERAL DESCRIPTION
|
Fairchild Semiconductor
|
| KA7307D |
GENERAL DESCRIPTION
|
Samsung semiconductor
|
| APM2301 |
Pin Description
|
TY Semiconductor Co., Ltd
|
| AOTF3N90L |
PACKAGE MARKING DESCRIPTION
|
Alpha & Omega Semiconductors
|
| AN2725 |
a brief description of the TS2012 device
|
STMicroelectronics
|
| TMS27PC512-12DDE TMS27PC512-12DDE4 TMS27PC512-10DU |
PLCC Clip-on Adapters; Top Pin Count: 32; Bottom Pin Count: 32; Part Description: PLCC IC Clip;
Diamond Particle Interconnect GHz MLF/QFN Sockets; Top Pitch (mm): 0.5; IC Size X (mm): 4; IC Size Y (mm): 4; Socket Lid: Swivel; Max Pincount: 20; Part Description: Diamond GHz QFN/MLF Socket (ZIF);
Diamond Particle Interconnect GHz MLF/QFN Sockets; Top Pitch (mm): 0.65; IC Size X (mm): 6; IC Size Y (mm): 6; Socket Lid: Swivel; Max Pincount: 28; Part Description: Diamond GHz QFN/MLF Socket (ZIF);
x8 EPROM x8存储
FPGA Development: XILINX; Top Pin Count: 84; Bottom Pin Count: 84; Top Interface: PLCC SOCKET; Bottom Interface: PLCC PLUG; Device Specific: yes; Devices Supported: XC3020, 3030, 3042; Part Description: Xilinx FPGA adapter; x8存储
|
Maxim Integrated Products, Inc.
Clare, Inc.
TE Connectivity, Ltd.
|
| AOK30B60D1 AOK30B60D1L |
TO247 PACKAGE MARKING DESCRIPTION
|
Alpha & Omega Semiconductors
|
| EME66XX |
IN-CIRCUIT EMULATOR HARDWARE DESCRIPTION
|
EM Microelectronic - MARIN SA
|
