| PART |
Description |
Maker |
| D-300-08CS1108 D-300-08CS1108-ND D-300-18 D-300-12 |
CAP, SPLICE ENCAPSULATION
|
PANDUIT CORP.
|
| R7X1210M R7X1210M-100 R7X1210M-101 R7X1210M-120 R7 |
ENCAPSULATION MOLDED CHIP INDUCTOR
|
MPS Industries, Inc.
|
| ASMT-JB11-NMP01 |
Silicone Encapsulation for LED Advantages and Handling Precautions
|
AVAGO TECHNOLOGIES LIMITED
|
| 2946117 |
Covering hood, for the contact and dust-protected encapsulation of the components, in green design.
|
PHOENIX CONTACT
|
| MBRB2545CT |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
|
Sangdest Microelectroni...
|
| 40CPQ015 |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
|
Sangdest Microelectroni...
|
| 303DMQ600 |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
|
Sangdest Microelectroni...
|
| ER1001FCT ER1004FCT ER1002FCT ER1006FCT ER1000FCT |
10A ISOLATION SUPER-FAST GLASS PASSIVATED RECTIFIER
METAL FILM RESISTORS, POWER, SURFACE MOUNT, MOLDED ENCAPSULATION, WRAPAROUND TERMINATION, WSF2515 47 1% T-1 B43
10A ISOLATION SUPER-FAST GLASS PASSIVATED RECTIFIER 10A条分离超快速玻璃钝化整
|
WTE[Won-Top Electronics]
Won-Top Electronics Co., Ltd.
PanJit International, Inc.
|
