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HSM88ASR - MPAK package is suitable for high density surface mounting and high speed assembly

HSM88ASR_7461415.PDF Datasheet

Part No.

HSM88ASR

Description

MPAK package is suitable for high density surface mounting and high speed assembly

File Size

56.07K / 1 Page

Maker

TY Semiconductor Co., Ltd

JITONG TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor

Part: HSM88AS

Maker: 三级

Pack: SOT23

Stock: Reserved

Unit price for :

50: $0.11

100: $0.10

1000: $0.10

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Full text search : MPAK package is suitable for high density surface mounting and high speed assembly

Product Description search : MPAK package is suitable for high density surface mounting and high speed assembly

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