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HSM88WA - MPAK package is suitable for high density surface mounting and high speed assembly

HSM88WA_7227575.PDF Datasheet


 Full text search : MPAK package is suitable for high density surface mounting and high speed assembly
 Product Description search : MPAK package is suitable for high density surface mounting and high speed assembly


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PART Description Maker
HSM88WA MPAK package is suitable for high density surface mounting and high speed assembly
TY Semiconductor Co., Ltd
HSM88AS MPAK package is suitable for high density surface mounting and high speed assembly
TY Semiconductor Co., Ltd
TMP47C102M TMP47C202P Zener Diode; Application: General; Pd (mW): 200; Vz (V): 4.42 to 4.61; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MPAK
Zener Diode; Application: General; Pd (mW): 200; Vz (V): 4.84 to 5.37; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MPAK 的CMOS 4位微控制
Toshiba Corporation
Toshiba, Corp.
TLWJ1100T11 TLWJ1100 Zener Diode; Application: General; Pd (mW): 200; Vz (V): 13.84 to 15.52; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MPAK
Zener Diode; Application: General; Pd (mW): 200; Vz (V): 13.37 to 13.96; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MPAK
Panel Circuit Indicator
Toshiba Corporation
Toshiba Semiconductor
TMP86C420FG Zener Diode; Application: General; Pd (mW): 200; Vz (V): 22.93 to 25.57; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MPAK
Toshiba Corporation
TMP86C407MG Zener Diode; Application: General; Pd (mW): 200; Vz (V): 20.88 to 21.77; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MPAK
Toshiba Corporation
TLYU267 TLYU267F Panel Circuit Indicator
Zener Diode; Application: General; Pd (mW): 200; Vz (V): 16.35 to 17.09; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MPAK
Toshiba Semiconductor
Toshiba Corporation
HVD372B Super small Flat Lead Package (SFP) is suitable for surface mount design
TY Semiconductor Co., Ltd
HVD355B Super small Flat Lead Package (SFP) is suitable for surface mount design
TY Semiconductor Co., Ltd
DF2S12S DF3A6.2FE Zener Diode; Application: General; Pd (mW): 200; Vz (V): 9.15 to 9.55; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MPAK 产品使用,但对静电放电(ESD)保护
Zener Diode; Application: General; Pd (mW): 200; Vz (V): 9.45 to 10.55; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: URP
Product for Use Only as Protection against Electrostatic Discharge (ESD).
Toshiba, Corp.
Toshiba Corporation
Toshiba Semiconductor
 
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