| PART |
Description |
Maker |
| CPSL |
Low Value, Commercial Power, Four Lead, Fireproof Inorganic Construction, Current Sensing, High Power/Size Ratio, Complete Welded Construction, High Thermal Conductivity and Moisture Resistance for Aqueous Board Wash Systems
|
Vishay
|
| 1N4007G 1N4004G 1N4001G 1N4002G 1N4002 1N4006 1N40 |
Rectifiers(整流 1 A, 1000 V, SILICON, SIGNAL DIODE
(1N4001G - 1N4007G) Rectifiers(Rugged glass package / using a high temperature alloyed construction)
IC REG VOLT 4.8V 240MA SOT-23
Rectifiers(Rugged glass package/ using a high temperature alloyed construction)
Rectifiers(Rugged glass package, using a high temperature alloyed construction) 1 A, 50 V, SILICON, SIGNAL DIODE
Rectifiers(Rugged glass package, using a high temperature alloyed construction) 整流器（坚固的玻璃封装，采用高温合金建设
Rectifiers(Rugged glass package, using a high temperature alloyed construction) 1 A, 400 V, SILICON, SIGNAL DIODE
|
PHILIPS[Philips Semiconductors]
http://
NXP Semiconductors N.V.
|
| PVI5033RS-TPBF |
Monolithic construction
|
International Rectifier
|
| 40SERIES 43NJR10E 47NJR10E 40NJR10E 41NJR10E 42NJR |
All-welded construction
|
Ohmite Mfg. Co.
|
| ENCL-KIT1 ENCL-KIT2 ENCL-KIT3 |
Tough ABS construction
|
rfsolutions.ltd
|
| 19001-11UL 19101-02UL 19101-11UL |
UL Recognized Rugged Construction
|
Grayhill, Inc
|
| MMBZ5250B |
Planar Die Construction
|
TY Semiconductor Co., Ltd
|
| KTC1027-O KTC1027-Y KTC1027-15 |
NPN Plastic Encapsulated Transistor
NPN Plastic Encapsulated Elektronische Bauelemente Transistor
|
SeCoS Halbleitertechnologie GmbH
SeCoS Halbleitertechnologie...
SeCoS Halbleitertechnol...
|
| CDRH8D43RT125NP-4R3NC CDRH8D43RT125NP-331MC CDRH8D |
Ferrite drum core construction.
|
Sumida Corporation
|
| CDH25D14HF-1R0NC CDH25D14HF-100MC CDH25D14HF-220MC |
Ferrite drum core construction
|
Sumida Corporation
|
