| PART |
Description |
Maker |
| 55PC7000 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 55PC2224 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 749010013 744761068A |
All 16 terminals must lie on a plane within 004 of surface A after lead tinning
specification for release
specification for release
|
Wurth Elektronik GmbH & Co. KG, Germany.
Wurth Elektronik GmbH &...
|
| ST16-19RFRDCS 7759 ST16 ST19-RFRDCS ST16-RFRDCS |
ST16-19RFRDCS CHIP SET INTERFACE SPECIFICATION
CHIP SET INTERFACE SPECIFICATION
From old datasheet system
|
ST Microelectronics
STMICROELECTRONICS[STMicroelectronics]
|
| XPC745BPX350LD XPC745BPX300LD MPC755BLDPND MPC755B |
MPC755 Part Number Specification for the XPC755BxxnnnLD and XPC745BxxnnnLD Series
Part Number Specification for the XPC755BxxnnnLD andXPC745BxxnnnLD Series
|
Motorola
|
| ELC09D2R2F ELC09D100F ELC09D102F ELC09D2R3F ELC09D |
SPECIFICATION CHOKE COIL
This specification covers the CHOKE COIL
|
List of Unclassifed Manufacturers
|
| MPC7451RXSXPND MPC7451RXSXPNS |
MPC7451 Part Number Specification for the XPC7451RXnnnSx Series
Part Number Specification for the XPC7451RXnnnSx Series
|
Motorola
|
| CL05B104KP5NNWC |
SPECIFICATION
|
Samsung semiconductor
|
| TFS170D |
Specification
|
VECTRON[Vectron International, Inc]
|
| TFS71D |
Specification
|
VECTRON[Vectron International, Inc]
|
| CL10A226MQ8NRNE |
SPECIFICATION
|
Samsung semiconductor
|
