| PART |
Description |
Maker |
| NP291-04812-2-AC-14680 NP291-04812-2-G4-BF NP291-0 |
Fine Ball Grid Array (FBGA, 0.75mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| FBGA-SD |
Fine Pitch Ball Grid Array - Stacked Die
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| FL9B5BH030S-C FL9B5BH060S-C FL7B5BH FL9B5BH033S-C |
Ball-Grid-Array Thin Film Low-Pass Filter
|
ETC
List of Unclassifed Manufacturers
|
| BGA-320P-M06 |
PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
|
Fujitsu Limited
|
| UPD703201YGC-XXX-YEU-A UPD70F3201YGC-YEU-A UPD70F3 |
32-BIT, MROM, 20 MHz, MICROCONTROLLER, PQFP100 14 X 14 MM, LEAD FREE, FINE PITCH, PLASTIC, TQFP-100
32-BIT, FLASH, 20 MHz, MICROCONTROLLER, PBGA121 12 X 12 MM, LEAD FREE, PLASTIC, BGA-121
|
LEDtronics, Inc.
|
| FLGA-SD |
Fine Pitch Land Grid Array - Stacked Die
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| 1565360-9 1565359 1565359-1 1565359-3 1565359-5 15 |
ON TAPING 0.5MM PITCH FINE MATE CONN. TAB ASSEMBLY
|
Tyco Electronics
|
| 24-5.02-030-002-829 24-5.02-034-003-829 24-5.02-02 |
Fine Pitch SMT Board to Board Connectors
|
AVX Corporation
|
| NE2004VA10A A5800562 NE2004-VA10A |
Near edge thin film thermal printhead (8 dots / mm)
From old datasheet system
Near edge thin film thermal printhead (8 dot/mm)
Thermal Printheads > Fro Plastic Card > NE200*-, 300*-VA@ Series
|
Rohm CO.,LTD.
ROHM[Rohm]
|
| SOT545-3 |
plastic thermal enganced thin quad flat package
|
Philips Semiconductors
|
| ACT711S-13 |
ultra thin, plastic moulded package with a maximum height of 1.4 mm.
|
Advanced Crystal Techno...
|
| KP545R66E6F |
thin form plastic leaded chip carried(PLCC)
|
KODENSHI KOREA CORP.
|
