| PART |
Description |
Maker |
| 21-0542 |
PACKAGE OUTLINE 12 BUMPS, WLP PKG, 0.4MM PITCH
|
Maxim Integrated Products
|
| TO263 |
Package Outline Drawing Transistor Outline 封装外形图晶体管外形
|
Electronic Theatre Controls, Inc.
ETC
List of Unclassifed Manufacturers
|
| SC70-5 |
Surface mounted, 5 pin package Package outline
|
ZETEX[Zetex Semiconductors]
|
| AP2305GN-HF AP2305GN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| TQFN3.5X3.5-14 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT143 |
Package Outline
|
Global Mixed-mode Techn...
|
| TDFN3X4-8 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-14-EP |
Package Outline
|
Global Mixed-mode Techn...
|
| WLCSP2X2-4 |
Package Outline
|
Global Mixed-mode Techn...
|
| WLCSP6X7-42 |
Package Outline
|
Global Mixed-mode Techn...
|
| WLCSP6X6-36 |
Package Outline
|
Global Mixed-mode Techn...
|
