| PART |
Description |
Maker |
| 449-10-204-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 349-10-104-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 860-10-050-10-002000 |
Interconnect Header 1mm Grid; Straight Pin Header
|
Mill-Max Mfg. Corp.
|
| 0901200960 90120-0960 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Vertical, 40 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0702800448 70280-0448 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, Tin (Sn) Plating, 2.72mm (.107) PC Tail Length
MOLEX Connector
|
Molex Electronics Ltd.
|
| SD-71308-001 0713085436 |
2.54mm (.100) Pitch C-Grid? Header
|
Molex Electronics Ltd.
|
| 90136-2210 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0901362202 90136-2202 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Right Angle, Shrouded, 2 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0942422318 |
2.54mm (.100) Pitch, MOX Header, 2.54mm (.100) Grid, Through Hole, PCT, Vertical, 18 Circuit, White
MOLEX Connector
|
Molex Electronics Ltd.
|
| 829-22-004-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
| 829-22-016-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount SIngle Row Through Hole
|
Mill-Max Mfg. Corp.
|
|
