| PART |
Description |
Maker |
| 21-0041 |
PACKAGE OUTLINE, 8L, 14L, 16L SOIC, 150INCH
|
Maxim Integrated Products
|
| JV0805ML030A JV0805ML120A JV0805ML120L |
5.0mV Quad Micropower Rail-to-Rail CMOS Operational Amplifier, 14L CDIP 压敏电阻（多层陶瓷瞬态电压抑制器标准容量
5.0mV Quad Micropower Rail-to-Rail CMOS Operational Amplifier, 14L PDIP
10.0mV Quad Micropower Rail-to-Rail CMOS Operational Amplifier, 14L SOIC
|
DB Lectro, Inc.
DB Lectro Inc.
|
| ICS280PGLF ICS280 ICS280PG ICS280PGILF ICS280PGI |
From old datasheet system
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) 封装和封装尺寸（16引脚TSSOP封装173军医。体
|
Integrated Circuit Solu...
ICSI[Integrated Circuit Solution Inc]
Intersil, Corp.
|
| SC70-6 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| AP2305GN-HF AP2305GN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| TQFN4X4-16 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT27-1 |
Package outline
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| TDFN3X3-6 |
Package Outline
|
Global Mixed-mode Techn...
|
| WLCSP6X6-36 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN7X7-48 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT143 |
Package Outline
|
Global Mixed-mode Techn...
|
