| PART |
Description |
Maker |
| 3E26 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 3F4 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 3E55 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 4M2 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 3R1 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 3C34 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 3C96 |
Material specification
|
Ferroxcube International Holding B.V.
|
| EF32-K-H-14P-SW |
BOBBIN MATERIAL: PHENOLIC PIN MATERIAL: CP WIRE UL REC. UL 94V-0
|
FERYSTER Inductive Components Manufacturer
|
| EF25-K-H-14P-SW |
BOBBIN MATERIAL: PET PIN MATERIAL: CP WIRE UL REC. UL 94V-0
PHOSPHOR BRONZE
|
FERYSTER Inductive Components Manufacturer
FERYSTER Inductive Componen...
|
| K4S641632H-UC60 K4S641632H-UC70 K4S641632H-UC75 K4 |
64Mb H-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) 64芯片与内存规格铅54 TSOP-II免费（符合RoHS
D-Subminiature Connector; Gender:Female; No. of Contacts:50; Contact Termination:IDC; D Sub Shell Size:DB50; Body Material:Steel; Contact Plating:Gold Over Nickel RoHS Compliant: Yes 64芯片与内存规格铅54 TSOP-II免费（符合RoHS
64Mb H-die SDRAM Specification 54 TSOP-II with Pb-Free 64芯片与内存规格铅54 TSOP-II免费
DELTA CONN 14POS PLUG W/O INSERT
DELTA CONN 14 POS PLUG BAIL LOCK
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
|
| 3D3 |
Material specification
|
Ferroxcube Internationa...
|
| OPB16450UART |
This document provides the specification
DS433 August 18, 2004 Product Specification
|
Xilinx, Inc.
|
