| PART |
Description |
Maker |
| 90-0175 |
PACKAGE LAND PATTERN, (U6) 6L SOT
|
Maxim Integrated Products
|
| 90-0171 |
PACKAGE LAND PATTERN, (U28) 4.4MM TSSOP
|
Maxim Integrated Products
|
| 90-0107 |
PACKAGE LAND PATTERN, (216) 0.300 SOIC, 16 LEADS
|
Maxim Integrated Products
|
| 90-0112 |
PACKAGE LAND PATTERN, 9S14) .150 SOIC 14 LEADS
|
Maxim Integrated Products
|
| 90-0167 |
PACKAGE LAND PATTERN, (E16) 0.150 QSOP, 16 LEADS
|
Maxim Integrated Products
|
| 90-0058 |
PACKAGE LAND PATTERN, (T633-2 / T633 2)
|
Maxim Integrated Products
|
| 90-0082 |
PACKAGE LAND PATTERN, (T1032N-1 / T1032N 1)
|
Maxim Integrated Products
|
| 90-0129 |
PACKAGE LAND PATTERN, (T4877-3 / T4877 3)
|
Maxim Integrated Products
|
| 90-0022 |
PACKAGE LAND PATTERN, (T2444-4 / T2444 4)
|
Maxim Integrated Products
|
| LPF2010T-3R3M LPF2010T-6R8M LPF2010T-2R2M LPF2010T |
Shape & Dimensions / Recommended Solder Land Pattern
|
ABCO ELECTRONICS CO.LTD
|
| LPF7032T-3R3M LPF7032T-100M LPF7032T-101M |
Shape & Dimensions / Recommended Solder Land Pattern
|
ABCO ELECTRONICS CO.LTD
|