| PART |
Description |
Maker |
| 8SOIC |
8 PIN SOIC PACKAGE OUTLINE
8 PIN SOIC PACKAGE OUTLINE
|
SMSC[SMSC Corporation]
|
| ICS280PGLF ICS280 ICS280PG ICS280PGILF ICS280PGI |
From old datasheet system
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) 封装和封装尺寸（16引脚TSSOP封装173军医。体
|
Integrated Circuit Solu...
ICSI[Integrated Circuit Solution Inc]
Intersil, Corp.
|
| SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| AP2305AGN-HF |
3.2 A, 30 V, 0.06 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| AP2317GN-HF |
4.2 A, 20 V, 0.052 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装（SSOP封装），EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp.
Fairchild Semiconductor Corporation
|
| TQFN4X4-16 |
Package Outline
|
Global Mixed-mode Techn...
|
| DFN1.6X1.6-6 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN3X4-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOD882 |
Package outline
|
STANFORD[Stanford Microdevices]
|
| TSSOP-28 |
Package Outline
|
Global Mixed-mode Techn...
|
