| PART |
Description |
Maker |
| 21-0041 |
PACKAGE OUTLINE, 8L, 14L, 16L SOIC, 150INCH
|
Maxim Integrated Products
|
| 21-0102 |
PACKAGE OUTLINE, 12,16L QFN, 3x3x0.90 MM
|
Dallas Semiconducotr
Dallas Semiconductor
|
| TO263 |
Package Outline Drawing Transistor Outline 封装外形图晶体管外形
|
Electronic Theatre Controls, Inc.
ETC
List of Unclassifed Manufacturers
|
| SC70-6 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| SC70-5 |
Surface mounted, 5 pin package Package outline
|
ZETEX[Zetex Semiconductors]
|
| AP2311GN-HF AP2311GN-HF-14 |
1.8 A, 60 V, 0.25 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electronics ...
|
| AP2305GN-HF AP2305GN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| BL-HA135A-TRB |
Quad N-Channel EPAD Matched Pair MOSFET Array, Vgs= 0.4 V, 16L SOIC, EPAD Enabled
Amber Mono-color type 2.0x1.25x1.0mm(0805) standard package.
|
Bright LED Electronics Corp.
|
| WLCSP2X2-4 |
Package Outline
|
Global Mixed-mode Techn...
|
| TO252-5 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN3.8X6.2-44 |
Package Outline
|
Global Mixed-mode Techn...
|
