| PART |
Description |
Maker |
| TO263 |
Package Outline Drawing Transistor Outline 封装外形图晶体管外形
|
Electronic Theatre Controls, Inc.
ETC
List of Unclassifed Manufacturers
|
| MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
| SC70-6 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| AP2305BGN-HF AP2305BGN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| SOP-8 |
Package Outline
|
Global Mixed-mode Techn...
|
| TDFN3X4-8 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN5X5-40 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN4X4-16 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN4X4-24 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN5X5-12 |
Package Outline
|
Global Mixed-mode Techn...
|
