| PART |
Description |
Maker |
| ZTACV-MX ZTTCV-MX |
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
|
ILSI America LLC
|
| ZTA-MG ZTA-MT ZTA-MX |
2 Pad and 3 Pad Ceramic Package, 5.5 mm x 10 mm
|
ILSI America LLC
|
| IL3X-HX5F12.5-32.768 |
2 Pad Ceramic Package, 1.5 mm x 3.2 mm
|
ILSI America LLC
|
| IL3Y-HX5F6.0-32.768 IL3Y-HX5F12.5-32.768 |
2 Pad Glass Package Quartz Crystal, 1.5 mm x 4.1 mm
|
ILSI America LLC
|
| J68.APACKAGE |
68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
|
Intersil Corporation
|
| J68.BPACKAGE |
68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
|
Intersil Corporation
|
| 21-0137 |
PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3*3*0.80MM
|
Maxim Integrated Products
|
| AD8370AREZ |
750MHz Digitally Controlled Variable Gain Amplifier; Package: TSSOP_EP (3.0mm pad size); No of Pins: 16; Temperature Range: Industrial
|
ANALOG DEVICES INC
|
| HD4074224S04 HD4074224FP03 HD404201S HD40L4201DA |
LM3431/LM3431A/LM3431Q/LM3431AQ 3-Channel Constant Current LED Driver with Integrated Boost Controller; Package: TSSOP EXP PAD; No of Pins: 28; Container: Reel 4位微控制
4-Bit Microcontroller 4位微控制
|
Hitachi,Ltd.
Fairchild Semiconductor, Corp.
Sanyo Electric Co., Ltd.
|
| AD9222BCPZRL7-65 |
Octal, 12-Bit, 40/50/65 MSPS Serial LVDS 1.8 V A/D Converter; Package: LFCSP (9x9mm, 7.10 exposed pad); No of Pins: 64; Temperature Range: Commercial 8-CH 12-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, QCC64
|
Analog Devices, Inc.
|
