| PART |
Description |
Maker |
| ST23YS08 |
Smartcard MCU Smartcard MCU with Enhanced Security and 8 KBytes High-Density EEPROM
|
STMicroelectronics
|
| SET111411 SET111403 SET111412 SET111419 SET111404 |
High Density,High Current,3-Phase Full Wave Bridge Rectifier(????靛?400V,娓╁害55???骞冲??存??垫?45A,楂??搴?澶х?娴?涓???ㄦ尝妗ユ?娴??)
High Density,High Current,3-Phase Full Wave Bridge Rectifier(????靛?1000V,娓╁害55???骞冲??存??垫?30A,楂??搴?澶х?娴?涓???ㄦ尝妗ユ?娴??)
3 PHASE, 30 A, SILICON, BRIDGE RECTIFIER DIODE
High Density,High Current,3-Phase Full Wave Bridge Rectifier(????靛?150V,娓╁害55???骞冲??存??垫?45A,楂??搴?澶х?娴??涓???ㄦ尝妗ユ?娴??)
High Density,High Current,3-Phase Full Wave Bridge Rectifier(反向电压1000V,温度55℃时平均整流电流45A,高密大电三相全波桥整流器) 高密度，大电3 -相全波桥式整流器（反向电000V的温5℃时平均整流电流45A条，高密度，大电流，三相全波桥整流器
HIGH CURRENT, 3-PHASE FULL WAVE BRIDGE ASSEMBLY
|
Semtech, Corp.
Semtech Corporation
|
| ISPLSI1032 ISPLSI1032-60LG_883 ISPLSI1032-80LJ ISP |
In-System Programmable High Density PLD EE PLD, 17 ns, PQCC84
High-Density Programmable Logic
|
Lattice Semiconductor, Corp.
LATTICE[Lattice Semiconductor]
Lattice Semiconductor Corporation
|
| ISPLSI5512VA-70LB388 ISPLSI5512VA-70LB272 ISPLSI55 |
Electrically-Erasable Complex PLD
In-System Programmable 3.3V SuperWIDEHigh Density PLD
In-System Programmable 3.3V SuperWIDE High Density PLD
In-System Programmable 3.3V SuperWIDE?High Density PLD
|
Lattice Semiconductor Corporation
|
| ATV2500B-15KM/883 ATV2500BL-20KM/883 ATV2500BQL-30 |
High-Speed High-Density UV Erasable Programmable Logic Device OT PLD, 20 ns, PDIP40
High-Speed High-Density UV Erasable Programmable Logic Device UV PLD, 30 ns, CQCC44
High-Speed High-Density UV Erasable Programmable Logic Device UV PLD, 15 ns, CQCC44
High-Speed High-Density UV Erasable Programmable Logic Device UV PLD, 25 ns, CQCC44
High-Speed High-Density UV Erasable Programmable Logic Device OT PLD, 25 ns, PQCC44
High-Speed High-Density UV Erasable Programmable Logic Device UV PLD, 25 ns, CDIP40
High-Speed High-Density UV Erasable Programmable Logic Device OT PLD, 25 ns, PDIP40
ER 4C 4#8 SKT RECP BOX
Seals
Circular Connector; MIL SPEC:MIL-C-5015 E/F/R; Body Material:Aluminum Alloy; Series:MS3102; No. of Contacts:14; Connector Shell Size:22; Connecting Termination:Solder; Circular Shell Style:Box Mount Receptacle; Gender:Female RoHS Compliant: No
Circular Connector; No. of Contacts:14; Series:; Body Material:Aluminum Alloy; Connecting Termination:Solder; Connector Shell Size:22; Circular Contact Gender:Pin; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:22-19 RoHS Compliant: No
ER 14C 14#16 SKT RECP
CONTROL KNOB RoHS Compliant: Yes
ER 3C 3#8 SKT RECP BOX
ER 7C 7#16 PIN RECP
ER 3C 1#16 2#8 PIN RECP BOX
ER 9C 9#16 PIN RECP
|
Atmel, Corp.
Atmel Corp.
http://
ATMEL Corporation
|
| LTV8192M LTV-819-1S-TA LTV829S-V LTV-829S-TA LTV82 |
High Density Mounting Type Photocoupler 1 CHANNEL TRANSISTOR OUTPUT OPTOCOUPLER
High Density Mounting Type Photocoupler 2 CHANNEL TRANSISTOR OUTPUT OPTOCOUPLER
High Density Mounting Type Photocoupler(762.22 k) 高密度安装类型光电耦合62.22十一
|
Lite-On Technology, Corp.
|
| STMPE812 |
Enhanced 4-wire resistive touchscreen controller
|
ST Microelectronics
|
| ISPLSI2192VL-100LB144 ISPLSI2192VL-100LT128 ISPLSI |
2.5V In-System Programmable SuperFAST High Density PLD
TRIAC STANDARD 12A 400V TO-220AB
2.5V In-System Programmable SuperFASTHigh Density PLD
|
Lattice Semiconductor Corporation
|
| ISPLSI5512VE-155LF256 ISPLSI5512VE-155LB272 ISPLSI |
In-system programmable 3.3V SuperWIDE high density PLD. fmax 155 MHz, tpd 6.5 ns.
In-system programmable 3.3V SuperWIDE high density PLD. fmax 125 MHz, tpd 7.5 ns.
EE PLD, 10 ns, PBGA388
In-system programmable 3.3V SuperWIDE high density PLD. fmax 100 MHz, tpd 10 ns.
In-system programmable 3.3V SuperWIDE high density PLD. fmax 80 MHz, tpd 12 ns.
|
LATTICE SEMICONDUCTOR CORP
|
| ISPLSI5256VA ISPLSI5256VA-100LB208 ISPLSI5256VA-10 |
In-System Programmable 3.3V SuperWIDE⑩ High Density PLD
In-System Programmable 3.3V SuperWIDE High Density PLD
|
LATTICE[Lattice Semiconductor]
|
