| PART |
Description |
Maker |
| AM29DL400T-80EE AM29DL400T-80EI AM29DL400T-80FC AM |
-30V Dual P-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7306 with Standard Packaging
-30V Dual P-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7306 with Lead Free Packaging
-20V Dual P-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7104 with Lead Free Packaging
-30V Dual P-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7328 with Lead Free Packaging
30V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7303 with Standard Packaging
80V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7380QPBF with Standard Packaging
30V N-Channel PowerTrench MOSFET
20V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; A IRF9910 with Standard Packaging
50V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; Industrial version of our popular IRF7103PBF - standard packaging
55V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7341 with Lead Free Packaging
20V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7101 with Lead Free Packaging
-20V FETKY - MOSFET and Schottky Diode in a SO-8 package; Similar to IRF7322D1TR with Lead Free Packaging on Tape and Reel
-20V FETKY - MOSFET and Schottky Diode in a SO-8 package; Similar to IRF7422D2 with Lead Free Packaging
30V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF9956 with Lead Free Packaging
80V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7380 with Standard Packaging
20V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7301 with Standard Packaging
20V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7331 with Standard Packaging
50V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7103 with Standard Packaging
50V Dual N-Channel HEXFET Power MOSFET in a SO-8 package - Q101 Qualified; Similar to IRF7103Q with Lead-Free Packaging
-20V Dual P-Channel HEXFET Power MOSFET in a TSSOP-8 package; A IRF7750 with Standard Packaging
20V FETKY - MOSFET and Schottky Diode in a Micro 8 package; A IRF7521D1 with Standard Packaging
55V Dual N-Channel HEXFET Power MOSFET in a SO-8 package designed and qualified for the industrial market; Industrial version of our popular IRF7341PBF - standard packaging EEPROM
EEPROM EEPROM
80V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7380 with Lead Free Packaging
-12V Dual P-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7329 with Standard Packaging
|
Air Cost Control
Advanced Micro Devices, Inc.
|
| AM29F200BB-45EC AM29F200BB-120FC AM29F200BB-70FC A |
60V Single N-Channel HEXFET Power MOSFET in a TO-262 package; A IRFZ44VZL with Lead-Free Packaging
55V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU1010Z with Lead Free Packaging
100V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; Similar to the IRL2910 in lead free packaging
55V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRL3705N with Standard Packaging
55V Single N-Channel HEXFET Power MOSFET in a TO-262 package; A IRF3205L with Standard Packaging
75V Single N-Channel HEXFET Power MOSFET in a D-Pak package; Similar to IRFR2307Z with Lead Free Packaging
30V Single N-Channel HEXFET Power MOSFET in a I-Pak package; A IRLU7807ZCPBF with Standard Packaging
100V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; A IRF530NS with Standard Packaging
55V Single N-Channel HEXFET Power MOSFET in a I-Pak package; A IRFU1205 with Standard Packaging
100V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRF530NS with Lead Free Packaging
150V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRFB61N15D with Standard Packaging
55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; A IRF2805S with Lead-Free packaging
150V Single N-Channel HEXFET Power MOSFET in a TO-262 package; A IRFSL33N15D with Standard Packaging
20V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRLU3717 with Lead Free Packaging
30V Single N-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7463 with Standard Packaging
55V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRLU2705 with Lead Free Packaging
20V Single N-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7457 with Standard Packaging
55V Single N-Channel HEXFET Power MOSFET in a 7-Lead TO-262 package; Similar to IRF1405ZL-7P with Lead Free packaging
100V Single N-Channel HEXFET Power MOSFET in a TO-262 package; A IRF540NL with Standard Packaging
30V Single N-Channel HEXFET Power MOSFET in a D-Pak package; A IRLR7811WCPBF with Standard Packaging
200V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; A IRFS23N20D with Standard Packaging
30V Single N-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7834 with Standard Packaging
55V Single N-Channel HEXFET Power MOSFET in a D-Pak package; Similar to IRFR4105Z with Lead Free Packaging
20V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRLU3714 with Lead Free Packaging
100V Single N-Channel HEXFET Power MOSFET in a D2Pak package; Similar to IRF8010S with Lead-Free packaging.
100V Single N-Channel Automotive HEXFET Power MOSFET in a D-Pak package; Similar to IRFR3710Z with Lead Free Packaging
55V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRF3205PBF with Standard Packaging
100V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRF3710Z with Standard Packaging
200V Single N-Channel HEXFET Power MOSFET in a TO-262 package; Similar to IRFSL17N20D with Lead Free Packaging
150V Single N-Channel HEXFET Power MOSFET in a TO-262 package; Similar to IRFSL23N15D with Lead Free Packaging
x8/x16 Flash EEPROM x8/x16闪存EEPROM
|
Advanced Micro Devices, Inc.
|
| 87914-2216 0879142216 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| AM29845AJC AM29845A/BLA AM29845ADMB AM29845APC AM2 |
600V UltraFast 8-25 kHz Discrete IGBT in a TO-220AB package; A IRG4BC30K with Standard Packaging
1200V UltraFast 4-20 kHz Discrete IGBT in a TO-247AC package; A IRG4PH50K with Standard Packaging
600V UltraFast 8-60 kHz Discrete IGBT in a TO-247AC package; A IRG4PC40U with Standard Packaging
600V UltraFast 8-25 kHz Discrete IGBT in a TO-247AC package; Similar to IRG4PC40K with Lead Free Packaging
1200V UltraFast 8-25 kHz Single IGBT in a TO-274AA package; A IRGPS40B120U with Standard Packaging
600V UltraFast 8-60 kHz Discrete IGBT in a TO-247AC package; A IRG4PC50U with Standard Packaging
1200V UltraFast 8-40 kHz Discrete IGBT in a TO-274AA package; A IRG4PSH71U with Standard Packaging
1200V UltraFast 4-20 kHz Discrete IGBT in a D2-Pak package; A IRG4BH20K-S with Standard Packaging
600V Fast 1-8 kHz Discrete IGBT in a TO-247AC package; A IRG4PC50F with Standard Packaging
1200V UltraFast 5-40 kHz Discrete IGBT in a TO-247AC package; A IRG4PH50U with Standard Packaging
10-Bit D-Type Latch
600V Warp 60-150 kHz Discrete IGBT in a TO-262 package; A IRG4BC40WL with Standard Packaging 8位D型锁存器
8-Bit D-Type Latch 8位D型锁存器
|
Bourns, Inc.
|
| PST9346U PST9319U PST9342U PST9339U PST9338U PST93 |
-40V Single P-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7241 with Lead Free Packaging
-55V Single P-Channel HEXFET Power MOSFET in a D-Pak package; A IRFR9024NCPBF with Standard Packaging
-55V Single P-Channel HEXFET Power MOSFET in a D2-Pak package; A IRF9Z24NS with Standard Packaging
-20V Single P-Channel HEXFET Power MOSFET in a Micro 3 package; A IRLML6402 with Tape and Reel Packaging
-55V Single P-Channel HEXFET Power MOSFET in a TO-220AB package; A IRF5305 with Standard Packaging
Voltage Detector 电压检测器
-12V Single P-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7220 with Standard Packaging 电压检测器
-30V Single P-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7406 with Standard Packaging
-100V Single P-Channel HEXFET Power MOSFET in a I-Pak package; A IRFU9120N with Standard Packaging
|
Maxim Integrated Products, Inc.
|
| VRA2415ZP-6WR2 VRA2412ZP-6WR2 |
REGULATED DUAL/SINGLE OUTPUT DIP PACKAGING, DC-DC CONVERTER
|
MORNSUN Science& Techno...
|
| 87914-2816 0879142816 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0879143416 87914-3416 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0879144816 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 48 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 48 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| G8343-11 G8343-12 G8343-21 G8343-22 G8343-31 G8343 |
InGaAs PIN photodiode with preamp
Aluminum Snap-In Capacitor; Capacitance: 1500uF; Voltage: 160V; Case Size: 25x45 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 270uF; Voltage: 400V; Case Size: 35x25 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 180uF; Voltage: 400V; Case Size: 30x25 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 150uF; Voltage: 450V; Case Size: 25x30 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 390uF; Voltage: 200V; Case Size: 22x25 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 330uF; Voltage: 400V; Case Size: 25x45 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 1000uF; Voltage: 200V; Case Size: 25x50 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 270uF; Voltage: 400V; Case Size: 25x40 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 270uF; Voltage: 400V; Case Size: 30x30 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 270uF; Voltage: 400V; Case Size: 22x50 mm; Packaging: Bulk
Optoelectronic 光电
InGaAs PIN photodiode with preamp 铟镓砷PIN光电二极管和前置放大
|
HAMAMATSU[Hamamatsu Corporation]
NXP Semiconductors N.V.
Hamamatsu Photonics K.K.
|
| AM29L516DC AM29L517DC AM29L517AXC AM29L517/BXC AM2 |
Dimming Ballast Control, Brown-out Protection, Programmable Preheat Time, 1.8us Deadtime in a 16-lead SOIC Narrow package; A IR21593S with Standard
Dimming Ballast Control, Brown-out Protection, Programmable Preheat Time, 1.8us Deadtime in a 16-lead SOIC Narrow package; A IR21592S with Tape
Dimming Ballast Control, Brown-out Protection, Programmable Preheat Time, 1.8us Deadtime in a 16-lead SOIC Narrow package; A IR21592S with Standard
Half Bridge Driver, LO In Phase with RT, Programmable Oscillating Frequency, 0.6us Deadtime in a 8-lead SOIC package and different phase; Similar to IR21531S with Lead Free Packaging
Hi-Rel DC-DC Standard Dual Converter in a ATR package; A ATR2815D with Standard Packaging
Ballast Control, Programmable Preheat Time and Run Frequency, Programmable Deadtime in a 14-pin DIP package; A IR2156 with Standard Packaging
Hi-Rel DC-DC Standard Triple Converter in a ATR package; A ATR2815T with Standard Packaging
Hi-Rel DC-DC Rad-Hard Triple Converter in a ART package; A ART2812T with Standard Packaging
600V Ballast Controller IC with Adaptive Zero-Voltage Switching, Internal Crest Factor Over-Current Protection and an Integrated Bootstrap Diode in a 8-Pin SOIC package.; Similar to IR2520DS with Lead Free Packaging
Multiplier 乘数
|
Rochester Electronics, LLC
|
|
