| PART |
Description |
Maker |
| FPT-8P-M01 |
SMALL OUTLINE L-LEADED PACKAGE
|
Fujitsu Component Limited.
FUJITSU[Fujitsu Media Devices Limited]
|
| FPT-28P-M17 |
SMALL OUTLINE L-LEADED PACKAGE 28 PIN PLASTIC
|
Fujitsu Component Limited.
FUJITSU[Fujitsu Media Devices Limited]
|
| AP1333GU-HF-14 |
Small Package Outline
|
Advanced Power Electron...
|
| FDG6322C |
Very small package outline SC70-6.
|
TY Semiconductor Co., L...
|
| SO-8 |
8-LEAD SMALL OUTLINE PACKAGE
|
STMicroelectronics
|
| POWERSOP |
Power Small Outline Package,PowerSOP
|
Amkor Technology
|
| AP2302GN-HF AP2302GN-HF-14 |
Capable of 2.5V gate drive, Small package outline
|
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| AK18D300-TSOP AK14D300-TSOP AK20D300-TSOP |
Thin Small Outline Package TSOP DIP Adapters
|
ACCUTEK MICROCIRCUIT CORPORATION
ACCUTEK MICROCIRCUIT CORPOR...
ACCUTEK MICROCIRCUIT CO...
|
| AP2310GN |
Simple Drive Requirement Small Package Outline Surface Mount Device
|
TY Semiconductor Co., Ltd
|
| RQ-16 |
16-Lead Shrink Small Outline Package [QSOP] Dimensions shown in inches
|
Analog Devices
|
| MT2LDT432HG-6X MT2LDT432HG-5X MT4LDT832HG-5XS MT2L |
SMALL-OUTLINE DRAM MODULE 小外形DRAM模块
Silver Mica Capacitor; Capacitance:1200pF; Capacitance Tolerance: 5%; Series:CDV30; Voltage Rating:1500VDC; Capacitor Dielectric Material:Mica; Termination:Radial Leaded; Lead Pitch:11.1mm; Leaded Process Compatible:No RoHS Compliant: No 小外形DRAM模块
|
Micron Technology, Inc.
|
