| PART |
Description |
Maker |
| 80C35 TMP80C48AU-6 |
CMOS 8-BIT SINGLE-CHIP MICROCOMPUTER (TLCS-48C) 的CMOS 8位单片机（薄层扫描法- 48C
|
Toshiba Semiconductor
Toshiba, Corp.
Toshiba Corporation
|
| TMP80C49AU-6 80C39AP TMP80C39AP |
CMOS 8-BIT SINGLE-CHIP MICROCOMPUTER (TLCS-48C) 的CMOS 8位单片机（薄层扫描法- 48C
|
Toshiba Corporation
Toshiba, Corp.
|
| A29L400ATM-70F A29L400ATM-90IF A29L400ATM-70UF A29 |
ER 3C 3#12 PIN PLUG
ER 48C 48#16 PIN RECP 12k × 8 256 × 16位的CMOS 3.0伏只，引导扇区闪
Replaced by PT78NR107,PT78ST107,PT78ST174 : 7.15Vout 1.5A Wide Input Positive Step-Down ISR 3-SIP MODULE -40 to 85 12k × 8 256 × 16位的CMOS 3.0伏只，引导扇区闪
512K X 8 Bit / 256K X 16 Bit CMOS 3.0 Volt-only, Boot Sector Flash Memory 12k × 8 256 × 16位的CMOS 3.0伏只，引导扇区闪
Replaced by PT78ST105 : 5Vout 1.5A Wide Input Positive Step-Down ISR 3-SIP MODULE -40 to 85 12k × 8 256 × 16位的CMOS 3.0伏只，引导扇区闪
ER 48C 48#16 SKT RECP 12k × 8 256 × 16位的CMOS 3.0伏只，引导扇区闪
MS3106A16-10SW 12k × 8 256 × 16位的CMOS 3.0伏只，引导扇区闪
ER 8C 8#12 SKT RECP
|
http://
Sanyo Denki Co., Ltd.
AMIC Technology, Corp.
AMIC Technology Corporation
|
| WF131100 |
HEATSINK
|
celduc-relais
|
| WF115100 |
HEATSINK
|
celduc-relais
|
| DO1 DO2 DO3 |
Heatsink DOx
|
HB Electronic Components
|
| LS220 |
HEATSINK TO220-TO3P 17.0C-W
|
ETC
|
| 2XP8.5/150 |
Heatsink For capsule devices 散热器为胶囊设备
|
SEMIKRON
|
| PQ60012QTA40 PQ60012QTA40NKS PQ60012QTA40NYS PQ600 |
40 Amp, No Heatsink, Isolated DC/DC Converter
|
SynQor Worldwide Headquarters
|
| LPS1100L48R7KNZAX LPS1100110XXXBO15E LPS110011XXXB |
Power Resistor for Mounting onto a Heatsink
|
Vishay Siliconix
|
| PQ48025HTA60 PQ48025HTA60PKF PQ48025HTA60PKS PQ480 |
60 Amp, No Heatsink, Isolated DC/DC Converter
|
SynQor Worldwide Headquarters
|
| PQ60033HMA30NNF PQ60033HMA30NNS PQ60033HMA30 PQ600 |
30 Amp, No Heatsink, Isolated DC/DC Converter
|
SynQor Worldwide Headquarters
|
