| PART |
Description |
Maker |
| 0478-0-18-01-30-27-04-0 0501-0-15-01-30-27-04-0 05 |
BERYLLIUM COPPER, GOLD (30) OVER NICKEL FINISH, PCB TERMINAL
BERYLLIUM COPPER ALLOY, TIN (100) OVER NICKEL FINISH, PCB TERMINAL
BERYLLIUM COPPER, MATTE TIN (200) OVER NICKEL FINISH, PCB TERMINAL
BERYLLIUM COPPER ALLOY, TIN LEAD (100) OVER NICKEL FINISH, PCB TERMINAL
|
MILL-MAX MFG CORP
|
| 0349-4-31-15-34-01-10-0 0324-3-15-15-34-01-10-0 03 |
BERYLLIUM COPPER, TIN LEAD (200) OVER NICKEL FINISH, PCB TERMINAL
BERYLLIUM COPPER, TIN (200) OVER NICKEL FINISH, PCB TERMINAL
BERYLLIUM COPPER, GOLD (30) OVER NICKEL FINISH, PCB TERMINAL
|
MILL-MAX MFG CORP
|
| 0401-0-15-01-47-01-04-0 8303-0-15-80-47-80-04-0 |
BERYLLIUM COPPER, TIN LEAD (200) OVER NICKEL FINISH, PCB TERMINAL
BERYLLIUM COPPER, TIN (200) OVER NICKEL FINISH, PCB TERMINAL
|
MILL-MAX MFG CORP
|
| 6252-0-15-01-35-02-10-0 6252-0-15-01-35-84-10-0 |
BERYLLIUM COPPER ALLOY, TIN LEAD (100) OVER NICKEL FINISH, PCB TERMINAL
BERYLLIUM COPPER ALLOY, TIN (100) OVER NICKEL FINISH, PCB TERMINAL
|
MILL-MAX MFG CORP
|
| 0713086474 |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 74 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 74 Circuits1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30m
|
Molex Electronics Ltd.
|
| 0713086472 |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 72 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 72 Circuits,1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30
|
Molex Electronics Ltd.
|
| 1179-0-00-01-00-00-33-0 |
BRASS, TIN LEAD (200) OVER NICKEL FINISH, PCB TERMINAL
|
MILL-MAX MFG CORP
|
| T-1S6-13-T-2 |
PHOSPHOR BRONZE, TIN (200) OVER NICKEL FINISH, PCB TERMINAL
|
SAMTEC INC
|
| 0008500113 |
KK? Crimp Terminal, 22-30 AWG, Hot Tin (Sn) Dip, Nickel (Ni) Under Plating
|
Molex Electronics Ltd.
|
| 0901301128 90130-1128 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 28 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 28 Circuits, Black, 3楼矛m (118楼矛) Tin (Sn) over Nickel (Ni)
|
Molex Electronics Ltd.
|
| 0814-0-15-80-34-01-04-0 5059-0-15-01-34-27-04-0 03 |
BERYLLIUM COPPER ALLOY, TIN LEAD (200) OVER NICKEL FINISH, PCB TERMINAL
BERYLLIUM COPPER, GOLD (30) OVER NICKEL FINISH, PCB TERMINAL
BERYLLIUM COPPER ALLOY, GOLD (30) OVER NICKEL FINISH, PCB TERMINAL
BERYLLIUM COPPER ALLOY, TIN (200) OVER NICKEL FINISH, PCB TERMINAL
|
MILL-MAX MFG CORP
|
| 0383-1-17-01-34-01-02-0 |
BERYLLIUM COPPER, TIN LEAD (200) OVER NICKEL FINISH, PCB TERMINAL
|
MILL-MAX MFG CORP
|
|
