| PART |
Description |
Maker |
| 0702800458 70280-0458 |
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail 2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail
|
Molex Electronics Ltd.
|
| 0022284127 |
2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Vertical, 12 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0022235051 A-43009-0014 22-23-5051 |
2.54mm (.100) Pitch KK? Solid Header, Vertical, 5 Circuits, with Kinked PC Tails 2.54mm (.100) Pitch KK庐 Solid Header, Vertical, 5 Circuits, with Kinked PC Tails MOLEX Connector
|
Molex Electronics Ltd.
|
| 0022235061 A-43009-0015 22-23-5061 |
2.54mm (.100) Pitch KK? Solid Header, Vertical, 6 Circuits, with Kinked PC Tails 2.54mm (.100) Pitch KK庐 Solid Header, Vertical, 6 Circuits, with Kinked PC Tails MOLEX Connector
|
Molex Electronics Ltd.
|
| 0901200960 90120-0960 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Vertical, 40 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 90147-1114 0901471114 |
2.54mm (.100) Pitch C-Grid庐 PC Board Connector, Single Row, Vertical, 14 Circuits 2.54mm (.100) Pitch C-Grid? PC Board Connector, Single Row, Vertical, 14 Circuits
|
Molex Electronics Ltd.
|
| 90147-1107 0901471107 |
2.54mm (.100) Pitch C-Grid? PC Board Connector, Single Row, Vertical, 7 Circuits 2.54mm (.100) Pitch C-Grid垄莽 PC Board Connector, Single Row, Vertical, 7 Circuits
|
Molex Electronics Ltd.
|
| 87914-3616 0879143616 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0015910360 015-91-0360 71308-0136N |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 36 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating MOLEX Connector
|
Molex Electronics Ltd.
|
| 0015910040 015-91-0040 713080104N |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 4 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating MOLEX Connector
|
Molex Electronics Ltd.
|
| 0015910140 015-91-0140 A713080114N |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating MOLEX Connector
|
Molex Electronics Ltd.
|
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