| PART |
Description |
Maker |
| 1FGSXXXX |
Ball Grid Array Socketing System
|
Advanced Interconnections
|
| LFBGA-H FBGA |
Fine Pitch Ball Grid Array
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| NP396-500 |
Shrink Ball Grid Array (1.27mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| NP276-16951 NP276-25626 NP276-11904-3 NP276-59608 |
Ball Grid Array (BGA, 1.27mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| IC280-720-106 IC280-256-211 IC280-69605.AC-08327 I |
Ball Grid Array (FBGA / CSP / LGA)
|
Yamaichi Electronics Co., Ltd.
|
| 1-54-712 1-54-724 1-54-716 1-54-732 1-54-708 |
HAMMER BALL PEIN 12OZ
HAMMER BALL PEIN 24OZ
HAMMER BALL PEIN 32OZ
HAMMER BALL PEIN 8OZ
HAMMER BALL PEIN 16OZ 锤球石工16安士
|
ITT, Corp.
|
| SM2001 |
I.C. Socket, Pin Grid Array
|
Thomas & Betts
|
| PGM08XXX-XX PGM12XXX-XX |
IC Socket / Pin Grid Array
|
Aries Electronics
|
| FLGA-SD |
Fine Pitch Land Grid Array - Stacked Die
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| YPKG-C7CG-A7A2DC |
CCGA1272, 37.5 MM X 37.5 MM, 1.0 MM PITCH, 1272 SOLDER COLUMNS, CERAMIC COLUMN GRID ARRAY, DAISY CHAIN PACKAGE
|
Actel Corporation
|
| 0787884823 |
Milli-Grid Receptacle, Surface Mount, Vertical, Top Entry, without Plastic Pegs
|
Molex Electronics Ltd.
|
