| PART |
Description |
Maker |
| MAX1027-MAX1031 MAX1029AEEP-T MAX1027AEEE-T MAX102 |
10-Bit 300ksps ADCs with FIFO, Temp Sensor, Internal Reference
-10-Bit 300ksps ADCs with FIFO,Temp Sensor, Internal Reference
10-Bit 300ksps ADCs with FIFO. Temp Sensor. Internal Reference 10位300ksps ADC，带有FIFO、温度传感器及内置基
10-Bit 300ksps ADCs with FIFO,Temp Sensor, Internal Reference 1000ksps速率ADC的带有FIFO，温度传感器，内部参
10-Bit 300ksps ADCs with FIFO,Temp Sensor, Internal Reference 8-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO16
|
MAXIM - Dallas Semiconductor
Maxim Integrated Products, Inc.
|
| 27C4100 27C4096 MX27C4096 MX27C4096PI-12 MX27C4096 |
(MX27C4100 / MX27C4096) 4M-BIT [512K x 8/256K x 16] CMOS EPROM
4M-BIT [512K x 8/256K x 16] CMOS EPROM 256K X 16 OTPROM, 120 ns, PDIP40
4M-BIT [512K x 8/256K x 16] CMOS EPROM 256K X 16 OTPROM, 100 ns, PDIP40
4M-BIT [512K x 8/256K x 16] CMOS EPROM 256K X 16 OTPROM, 150 ns, PDIP40
4M-BIT [512K x 8/256K x 16] CMOS EPROM 256K X 16 OTPROM, 150 ns, PDSO40
Single Output LDO, 50mA, Fixed(3.0V), Low Quiescent Current, Thermal Protection 5-SOT-23 256K X 16 OTPROM, 100 ns, PDIP40
|
Macronix International Co., Ltd.
|
| AM7200-35RC AM7200-35JC AM7200-35PC AM7200-50JC AM |
HIGH DENSITY FIRST-IN FIRST-OUT (FIFO) 256 X 9-BIT CMOS MEMORY 256 X 9 OTHER FIFO, 25 ns, PDIP28
HIGH DENSITY FIRST-IN FIRST-OUT (FIFO) 256 X 9-BIT CMOS MEMORY 256 X 9 OTHER FIFO, 50 ns, PDIP28
Circular Connector; No. of Contacts:13; Series:MS27508; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:10; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No
JT 13C 13#22D PIN WALL RECP
|
ADVANCED MICRO DEVICES INC
Advanced Micro Devices, Inc.
|
| 5962-8956806QUA 5962-8956805VUA 5962-8956805VYA 59 |
308ksps ADC with DSP Interface and 78dB SINAD
12-Bit 300ksps ADCs with FIFO, Temp Sensor, Internal Reference
x9 Asynchronous FIFO X9热卖异步FIFO
|
TOKO, Inc.
|
| IDT72V36110L7.5PF V36100L6PF |
3.3 VOLT HIGH-DENSITY SUPERSYNC II36-BIT FIFO 128K X 36 OTHER FIFO, 5 ns, PQFP128
3.3 VOLT HIGH-DENSITY SUPERSYNC II??36-BIT FIFO
|
Integrated Device Technology, Inc.
INTEGRATED DEVICE TECHNOLOGY INC
|
| UPD444008 UPD444008LE-12 UPD444008LE-10 UPD444008L |
512K X 8 STANDARD SRAM, 12 ns, PDSO36 0.400 INCH, PLASTIC, SOJ-36
4M-BIT CMOS FAST SRAM 512K-WORD BY 8-BIT
|
NEC Corp.
|
| SL0-67202L-25EHXXX SL0-67202L-50LHXXX TEMICSEMICON |
1K X 9 OTHER FIFO, 25 ns
1K X 9 OTHER FIFO, 40 ns, CQCC32
1K X 9 OTHER FIFO, 50 ns, PDFP28
512 X 9 OTHER FIFO, 50 ns
|
TEMIC SEMICONDUCTORS
ATMEL WIRELESS & MICROCONTROLLERS
|
| 74HC7404 74HC7404D 74HC7404N 74HCT7404 74HCT7404D |
Dual 4-Input Positive-NAND Gates 14-TSSOP -40 to 85 5位64字FIFO寄存器，三
5-Bit x 64-word FIFO register 3-state
5-Bit x 64-word FIFO register; 3-state
|
NXP Semiconductors N.V.
Philips
|
| TC55VL818FF-75 |
512K Word x 18 Bit Synchronous No-turnround Static RAM(512K 字x18位同步无转向静RAM)
|
Toshiba Corporation
|
| KM29V040T |
512K x 8 Bit NAND Flash Memory(512K x 8NAND闪速存储器)
|
SAMSUNG SEMICONDUCTOR CO. LTD.
|
| MCM63P837ZP200R MCM63P919ZP200R MCM63P837ZP200 MCM |
512K X 18 CACHE SRAM, 3 ns, PBGA119
512K X 18 CACHE SRAM, 2.6 ns, PBGA119
256K x 36 and 512K x 18 Bit Pipelined BurstRAM Synchronous Fast Static RAM
|
FREESCALE SEMICONDUCTOR INC
Motorola, Inc
|
