| PART |
Description |
Maker |
| SDT04S60 SDD04S60 SDP04S60 Q67040-S4368 Q67040-S43 |
Heat Sink; Package/Case:TO-220; Thermal Resistance:20.3 C/W; Mounting Type:Through Hole; Body Material:Plastic; Color:Black; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No; Sink Material:Plastic RoHS Compliant: No
Heat Sink; Package/Case:TO-220; Thermal Resistance:20.3 C/W; Mounting Type:Through Hole; Length:18.03mm; Height:12.7mm; Width:25.4mm; Body Material:Plastic; Color:Black; Leaded Process Compatible:Yes RoHS Compliant: Yes
Silicon Carbide Schottky Diodes - 4A diode in TO220-3 package
Silicon Carbide Schottky Diodes - 4A diode in TO252 package
Silicon Carbide Schottky Diodes - 4A diode in TO220-2 package
|
INFINEON[Infineon Technologies AG]
|
| CYM6002K-25 |
32-BIT, 25 MHz, MICROPROCESSOR, XMA 5.780 X 3.300 INCH, HEAT SINK, SURFACE MOUNT PACKAGE
|
Cypress Semiconductor, Corp.
|
| ATS-55210R-C1-R0 |
High Performance X-CUT - Heat Sink, T412, BLACK-ANODIZED
High Perfomance X-CUT - Heat Sink, T412, BLACK-ANODIZED
|
Advanced Analog Technology, Inc.
Advanced Thermal Solutions, Inc.
|
| ATS-19G-116-C2-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
| 384-1017 |
Clip-On Heat Sink
|
List of Unclassifed Manufacturers
|
| CPC1968 |
5A Load Current with 5C/W Heat Sink
|
IXYS Corporation
|
| 780 |
Heat sink preheating not required
|
Laird Tech Smart Techno...
|
| LPD35-20B LPD35-35B LPD35-5B LPD35-10B LPD35-3B LP |
Low Pressure Drop Heat Sink
|
ALPHA
|
| MG1037-16 MG1017-16 MG1036-16 MG1010-11 MG1040-16 |
GUNN Diodes Cathode Heat Sink
|
Microsemi Corporation
|
| LPD60-7B LPD60-30B LPD60-10B LPD60-8B LPD60-20B LP |
Low Pressure Drop Heat Sink
|
ALPHA
|
| LPD45-25B LPD45-30B LPD45-10B LPD45-9B LPD45-6B LP |
Low Pressure Drop Heat Sink
|
ALPHA
|
