| PART |
Description |
Maker |
| CMX969 CMX969E2 CMX969P4 CMX969D5 |
RD-LAP/MDC4800 motient/ARDIS.
|
CONSUMER MICROCIRCUITS LIMITED
CMLMICRO[CML Microcircuits]
|
| MX929P4 |
Motient/ardis RD-LAP MDC4800 modem
|
MXCOM
|
| PUMA2S16000M-35 PUMA2S16000M-020 PUMA77S16000M-025 |
30MHZ, 8 LAP, IND TEMP, GREEN(FPGA)
15NS, 100 PQFP, IND TEMP(EPLD)
25NS, 100 PQFP, IND TEMP(EPLD)
20NS, 68 PLCC, COM TEMP(EPLD)
30MHZ, 3.3V, 8 LAP, IND TEMP(FPGA)
7NS, 100 TQFP, COM TEMP(EPLD)
32 MC CPLD,1.8V ISP CPLD,44 PIN TQFP(EPLD)
x32 SRAM Module X32号的SRAM模块
|
Fujitsu, Ltd.
|
| AT25HP512CI-10CI-2.7 AT25HP512CI-10CI-1.8 |
64K X 8 SPI BUS SERIAL EEPROM, DSO8 8 X 5 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8
|
Atmel, Corp.
|
| F061254 F051702 F060600 XF0521P |
LAP PLV10 H GRN GRN (TRANSPARENT LENS)
|
E-SWITCH
|
| PUMA77FV16006BI-90 PUMA77FV16006BI-90E PUMA2FV1600 |
44 TQFP(FPGA)
ADAPTER(FPGA)
2.4 GHZ RAVEN BOARD
20-PLCC(FPGA)
2.4 GHZ EVALUATION AND STARTER KIT
5K GATES FPSLIC AX LQFP, IND TEMP GREEN(FPGA)
SEC FPSLIC AX 10K GATES IND TEMP GREEN(FPGA)
FPSLIC AX 10K GATES LQFP TEMP IND GREEN(FPGA)
44 PLCC(FPGA)
EEPROM EEPROM
8 LAP(FPGA) EEPROM
|
TDK, Corp.
Mitsubishi Electric, Corp.
Toshiba, Corp.
|
| NX8341UH-AZ NX8341UN-AZ |
PLIERS, COMBINATION REDLINE 200MMPLIERS, COMBINATION REDLINE 200MM; Jaw type:Combination; Length:200mm; Handle type:High grip; Capacity, cutting hard wire:2.0mm; Capacity, jaw max:2mm; Joint Construction:lap; Length, jaw:44mm; Width,
NECs 1310 nm AlGalnAs MQW-DFB TOSA FOR 10 Gb/s APPLICATION
Triac; Thyristor Type:Snubberless; Peak Repetitive Off-State Voltage, Vdrm:1000V; On State RMS Current, IT(rms):8A; Gate Trigger Current (QI), Igt:50mA; Current, It av:8A; Gate Trigger Current Max, Igt:50mA RoHS Compliant: Yes
|
California Eastern Laboratories
|
| PUMA67S16000M-025 PUMA2S16000I-45 PUMA67S16000I-45 |
150NS, PLCC, COM TEMP(FLASH)
15NS, 44 PLCC, COM TEMP(EPLD)
30MHZ, 3.3V, 8 LAP, COM TEMP(FPGA)
20NS, 44 PLCC, COM TEMP(EPLD)
150NS, TSOP, IND TEMP(FLASH)
20NS, 44 TQFP, IND TEMP(EPLD)
120NS, SOIC, IND TEMP(EEPROM)
70NS, TSOP, IND TEMP(EEPROM)
15NS, 68 PLCC, IND TEMP(EPLD)
25NS, 68 PLCC, IND TEMP(EPLD)
30MHZ, 32 TQFP, COM TEMP(FPGA)
120NS, PDIP, IND TEMP(EEPROM)
32 MCROCELL CPLD 1.8V ISP TQFP IND GREEN(EPLD)
x32 SRAM Module X32号的SRAM模块
90NS, TSOP, IND TEMP(EEPROM) X32号的SRAM模块
120NS, PLCC, IND TEMP(EEPROM)
|
DB Lectro, Inc.
TE Connectivity, Ltd.
|
| PUMA2US2500I-2512 PUMA2US2500I-2510 PUMA2US2500I-2 |
10MS, 8 PDIP, IND TEMP, GREEN, 1.8V(SERIAL EE)
10MS, 8 EIAJ SOIC, IND TEMP, GREEN, 2.7V(SERIAL EE)
10MS, 8 SOIC, EXT TEMP, GREEN, 2.7V(SERIAL EE)
10MS, 8 SOIC, IND TEMP, GREEN, 2.7(SERIAL EE)
10MS, 8 TSSOP, IND TEMP, GREEN, 2.7(SERIAL EE)
10MS, 8 TSSOP, EXT TEMP, GREEN, 2.7V(SERIAL EE)
10MS, 8 SOIC, IND TEMP, GREEN, 2.7V(SERIAL EE)
10MS, DIE, 2.7V, 11 MILS THICKNESS(SERIAL EE)
10MS, 8 MINI-MAP, IND TEMP, GREEN, 1.8V(SERIAL EE)
10MS, 8 LAP, IND TEMP, GREEN, 2.7V(SERIAL EE)
SRAM/EPROM 静态存储器/存储
10MS, DIE, 1.8V, 11 MILS THICKNESS(SERIAL EE) 静态存储器/存储
|
TDK, Corp.
TE Connectivity, Ltd.
|
|
