| PART |
Description |
Maker |
| DFM14 |
Military, MIL-R-83401 Qualified, Type RZ, 11, 12, 15 Schematics, Hot Solder Dip, Highly Stable, Passes MIL-STD-202 Method 210, Condition E ""Resistance to Soldering Heat"" Test
|
Vishay
|
| LBH1035 |
Soldering methods : IR reflow soldering
From old datasheet system
|
List of Unclassifed Manufacturers
ETC[ETC]
|
| AM29DL323DB90WDIN AM29DL323DB120WDI AM29DL323DB120 |
500V Single N-Channel Hi-Rel MOSFET in a TO-204AA package; A IRF450 with Standard Packaging
500V Single N-Channel Hi-Rel MOSFET in a TO-254AA package; A JANTX2N7228 with Standard Packaging
500V Single N-Channel Hi-Rel MOSFET in a 18-pin LCC package; A IRFE430 with Standard Packaging
500V Single N-Channel Hi-Rel MOSFET in a 18-pin LCC package; A JANTX2N6802U with Standard Packaging
12V Single N-Channel Hi-Rel MOSFET in a SMD-0.5 package; A IRL7NJ3802 with Standard Packaging
60V Single N-Channel Hi-Rel MOSFET in a TO-257AA package; A IRFY044CM with Standard Packaging
100V Single N-Channel Hi-Rel MOSFET in a TO-254AA package; A IRFM140 with Standard Packaging
-20V Single P-Channel Hi-Rel MOSFET in a SMD-0.5 package; A IRL5NJ7404 with Standard Packaging
150V Single N-Channel Hi-Rel MOSFET in a TO-254AA package; A IRF5M3415 with Standard Packaging
500V Single N-Channel Hi-Rel MOSFET in a SMD-1 package; A JANTXV2N7222U with Standard Packaging
100V Single N-Channel Hi-Rel MOSFET in a TO-254AA package; A JANTXV2N7218 with Standard Packaging
200V Single N-Channel Hi-Rel MOSFET in a TO-254AA package; A IRFM260 with Standard Packaging
AME270461; A AME270461 with Standard Packaging x8/x16闪存EEPROM
AFC461; Qualified Part Number similar to AFC461 x8/x16闪存EEPROM
AME28461; A AME28461 with Standard Packaging x8/x16闪存EEPROM
x8/x16 Flash EEPROM x8/x16闪存EEPROM
100V Single N-Channel Hi-Rel MOSFET in a TO-204AE package; A JANTXV2N6764 with Standard Packaging x8/x16闪存EEPROM
IR2113L6; A IR2113L6 with Standard Packaging x8/x16闪存EEPROM
-55V Single P-Channel Hi-Rel MOSFET in a TO-254AA package; A IRF5M4905 with Standard Packaging x8/x16闪存EEPROM
|
Spansion, Inc.
|
| D74H4B-250KHZ D74H4B-33.3KHZ D74H4B-849HZ D74L4L-8 |
16 Pin DIP 4-Pole Filters 16引脚DIP 4极滤波器
Analog Filter 模拟滤波
Power Tip Soldering Tip Cartridge; Tip/Nozzle Style:60 Bevel; Tip/Nozzle Length:0.25"; Tip/Nozzle Width:0.07"; Features:Delivers heat more efficiently for lead-free hand soldering applications 16引脚DIP 4极滤波器
|
List of Unclassifed Manufacturers
ETC[ETC]
N.A.
Electronic Theatre Controls, Inc.
Frequency Devices
|
| MCN |
Molded Sip, Molded Epoxy Case, Solderability per MIL-STD-202 Method 208E, Marking Resistance to Solvents per MIL-STD-202 Method 215
|
Vishay
|
| AM29821DM AM29825DM AM29823DM AM29821DC AM29821A/B |
10-Bit D-Type Flip-Flop
300V 1 Form A Photo Voltaic Relay in a mod. 8-pin DIP Package; A PVA3324N with Standard Packaging
Complete Sensorless Drive Design Platform iMOTION Development System; A IRMCS2031 with Standard Packaging
High-voltage DC-DC buck converter for HB-LEDs constant current control; A IRPLLED1 with Standard Packaging
9-Bit D-Type Flip-Flop
20V 1 Form A Photo Voltaic Relay in a 6-pin DIP Package; A PVN012 with Standard Packaging
Halogen Convertor, 220/230VAC Input, 12VAC Output, 100VA Max; A IRPLHALO1E with Standard Packaging
250V 1 Form A Photo Voltaic Relay in a 6-pin SMT Package; A PVT312LS with Tape and Reel Packaging
Digital dimming DALI (Digital Addressable Lighting Interface) compliant lighting linear ballast with 1% dimming, IR2159, U.S. version, 120VAC line, 32W/T8 lamp; A IRPLDIM2U with Standard Packaging
A 3-Way CFL Dimming Ballast; A IRPLCFL4 with Standard Packaging 10位D型触发器
Octal D-Type Flip-Flop 八路D类触发器
|
Analog Devices, Inc.
|
| TMC1175A TMC1175AM7C20 TMC1175AM7C30 TMC1175AM7C40 |
Video A/D Conveter 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PDSO24
Video A/D Conveter 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PDIP24
Video A/D Conveter 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDSO24
Video A/D Conveter 视频A / D转换Conveter
Alkaline Battery; Voltage Rating:1.5V; Battery Size Code:C; Battery Capacity:71000mAh; Battery Terminals:Pressure Contact; Diameter:26.2mm; Height:50.0mm
CONNECTOR ACCESSORY
|
Fairchild Semiconductor, Corp.
Fairchild Semiconductor Corporation
FAIRCHILD[Fairchild Semiconductor]
|
| PSR54-9P PSA55-9R PSA55-7I PSR53-7R PSR53-9P PSR53 |
60V Single N-Channel Hi-Rel MOSFET in a TO-204AE package; A IRF054 with Standard Packaging
Analog IC
Fully optimized solution for high current synchronous buck multiphase applications in a LGA power block.; Similar to the iP2003A in Tape and Reel packaging.
500V Single N-Channel Hi-Rel MOSFET in a TO-259AA package; A IRFI460 with Standard Packaging
400V Single N-Channel Hi-Rel MOSFET in a TO-257AA package; A IRFY340CM with Standard Packaging
Synchronous Buck Multiphase Optimized BGA Power Block.; Tape and Reel version of the iP2002
-100V Single P-Channel Hi-Rel MOSFET in a 18-pin LCC package; A IRFE9110 with Standard Packaging
Synchronous Buck Multiphase Optimized BGA Power Block.; A IP2002 with Standard Packaging
-100V Single P-Channel Hi-Rel MOSFET in a TO-205AF package; A JANTXV2N6845 with Standard Packaging 模拟IC
Dual Output Full Function 2 Phase Synchronous Buck Power Block, Integrated Power Semiconductors, PWM Controller and Passives.; A IP1202 with Standard Packaging 模拟IC
|
TE Connectivity, Ltd.
|
| AM29F080-150EEB AM29F080-150SEB AM29F080-120FEB AM |
x8 Flash EEPROM
30V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRL3303S with Lead Free Packaging
20V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRL3502S with Lead Free Packaging
75V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRF3808S with Lead Free Packaging
30V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; Similar to IRF3707Z with Lead Free Packaging
75V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; A IRFS3307 with Standard Packaging
30V Single N-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7809AV with Lead Free Packaging
30V Single N-Channel HEXFET Power MOSFET in a D-Pak package; A IRFR3709ZCPBF with Standard Packaging
100V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRFB59N10D with Standard Packaging
30V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRL2703 with Standard Packaging x8闪存EEPROM
55V Single N-Channel HEXFET Power MOSFET in a SOT-223 package; Similar to IRFL024N with Lead Free Packaging x8闪存EEPROM
100V Single N-Channel HEXFET Power MOSFET in a TO-220 FullPak (Iso) package; Similar to IRFI530N with Lead Free Packaging
|
Amphenol, Corp.
|
| G8343-11 G8343-12 G8343-21 G8343-22 G8343-31 G8343 |
InGaAs PIN photodiode with preamp
Aluminum Snap-In Capacitor; Capacitance: 1500uF; Voltage: 160V; Case Size: 25x45 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 270uF; Voltage: 400V; Case Size: 35x25 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 180uF; Voltage: 400V; Case Size: 30x25 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 150uF; Voltage: 450V; Case Size: 25x30 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 390uF; Voltage: 200V; Case Size: 22x25 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 330uF; Voltage: 400V; Case Size: 25x45 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 1000uF; Voltage: 200V; Case Size: 25x50 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 270uF; Voltage: 400V; Case Size: 25x40 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 270uF; Voltage: 400V; Case Size: 30x30 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 270uF; Voltage: 400V; Case Size: 22x50 mm; Packaging: Bulk
Optoelectronic 光电
InGaAs PIN photodiode with preamp 铟镓砷PIN光电二极管和前置放大
|
HAMAMATSU[Hamamatsu Corporation]
NXP Semiconductors N.V.
Hamamatsu Photonics K.K.
|
| GCQ1555C1HR68CB01 |
Only Reflow Soldering
|
Murata Manufacturing Co...
|
