| PART |
Description |
Maker |
| PC7410M16 PC7410M16VG400L |
PC7410 2MByte backside L2-cache Multi-Chip Package
RISC microprocessor. 16 Mbits: 256K x 72 SSRAM. Max internal processor speed 400 MHz. 1.8V -100mV.
|
Atmel
|
| PC755BM8 |
PC755B 1MByte backside L2-cache Multi-Chip Package
|
Atmel
|
| IXSR35N120BD1 |
IGBT with Diode ISOPLUS 247 (Electrically Isolated Backside)
|
IXYS Corporation
|
| HMF51232M4Y-90 HMF51232M4Y-70 HMF51232M4Y-55 HMF51 |
FLASH-ROM MODULE 2MByte (512K x 32-Bit)
|
Hanbit Electronics Co.,Ltd.
|
| HMS51232M4G HMS51232M4G-20 HMS51232M4G-10 HMS51232 |
SRAM MODULE 2Mbyte (512K x 32-Bit), 72PIN SIMM, 5V
|
Hanbit Electronics Co.,Ltd.
HANBIT[Hanbit Electronics Co.,Ltd]
|
| HMS51232J4A-10 HMS51232J4A-12 HMS51232J4A-15 HMS51 |
SRAM MODULE 2Mbyte (512K x 32-Bit), 68-Pin JLCC Packaging
|
Hanbit Electronics Co.,Ltd
|
| VG2618165DJ-5 |
DRAM Chip, EDO DRAM, 2MByte, 5V Supply, Commercial, SOJ, 42-Pin
|
Vanguard International Semiconductor
|
| VG2618165CJ-5 |
DRAM Chip, EDO DRAM, 2MByte, 5V Supply, Commercial, SOJ, 42-Pin
|
Vanguard International Semiconductor
|
| MPX2301DT1 MPX2300DT1 |
MPX2300DT1 Chip Pak High Volume Pressure Sensor for Disposable, Backside Pressure Applications
High Volume Pressure Sensor For Disposable Applications
|
Motorola
|
