| PART |
Description |
Maker |
| MAX1430ETN-TD |
15-Bit, 100Msps ADC with -76.8dBFS Noise Floor for IF Applications
|
MAXIM INTEGRATED PRODUCTS INC
|
| MAX1427 |
15-Bit, 80Msps ADC with -79.3dBFS Noise Floor for Baseband Applications
|
MAXIM - Dallas Semiconductor
|
| MAX1419 MAX1419ETN MAX1418 |
15-Bit / 65Msps ADC with -79.3dBFS Noise Floor for Baseband Applications
15-Bit, 65Msps ADC with -79.3dBFS Noise Floor for Baseband Applications
|
MAXIM - Dallas Semiconductor
MAXIM[Maxim Integrated Products]
|
| MAX19588ETND MAX19588 |
High-Dynamic-Range, 16-Bit, 100Msps ADC with -82dBFS Noise Floor
|
MAXIM[Maxim Integrated Products]
|
| P13B16212A P13B16212V M464S3254DTS PC133 M464S3254 |
Protective Eyeglasses RoHS Compliant: NA
Personal protection, Spectacles; RoHS Compliant: NA
Electrically Conductive Floor Mat 1/8 inch x 4 feet x 8 feet RoHS Compliant: NA
32Mx64 SDRAM SODIMM based on 16Mx16, 4Banks, 8K Refresh,3.3V Synchronous DRAMs with SPD
32Mx64 SDRAM SODIMM based on 16Mx16 4Banks 8K Refresh3.3V Synchronous DRAMs with SPD
|
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
|
| 1ML06-031-09AN05 1ML06031AN05 |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
Thermoelectric Cooling Solutions
|
RMT Ltd.
|
| 1MC06-007-05 1MC06-007-0512 |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
RMT Ltd.
|
| 1ML06-023-09T |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
RMT Ltd.
|
| 1MX06-071-08 1MX06-071-12 1MX06-071-05 1MX06-071-0 |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
RMT Ltd.
|
| 1MX06-063-051 |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
RMT Ltd.
|
