| PART |
Description |
Maker |
| CSSOP |
Ceramic Shrink Small Outline Package
|
Amkor Technology
|
| AP2321GN-HF AP2321GN-HF14 |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| FPT-8P-M02 |
SMALL OUTLINE L-LEADED PACKAGE 8 PIN PLASTIC
|
Fujitsu Limited
|
| AP2338GN-HF |
Capable of 1.8V Gate Drive, Small Outline Package
|
Advanced Power Electronics Corp.
|
| AP2302GN-HF AP2302GN-HF-14 |
Capable of 2.5V gate drive, Small package outline
|
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| FPT-8P-M02 |
SMALL OUTLINE L-LEADED PACKAGE 8 PIN PLASTIC
|
Fujitsu Component Limited.
Fujitsu Media Devices Limited
|
| AP2301AGN-HF AP2301AGN-HF-14 |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| AP2327GN-HF |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| AP2316GN-HF |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| AK18D300-TSOP AK14D300-TSOP AK20D300-TSOP |
Thin Small Outline Package TSOP DIP Adapters
|
ACCUTEK MICROCIRCUIT CORPORATION
ACCUTEK MICROCIRCUIT CORPOR...
ACCUTEK MICROCIRCUIT CO...
|
| RQ-16 |
16-Lead Shrink Small Outline Package [QSOP] Dimensions shown in inches
|
Analog Devices
|
| AP2310GN-HF |
Simple Drive Requirement, Small Package Outline, Surface Mount Device
|
Advanced Power Electronics Corp.
|
