| PART |
Description |
Maker |
| J20.BPACKAGE |
20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
|
Intersil Corporation
|
| J68.APACKAGE |
68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
|
Intersil Corporation
|
| PVM5YXX PVM2YFV PVM2YFW PVM2YXX PVM4VBV PVM4VBW PV |
6 Pad Leadless Surface Mount or 4 Lead Thru-Hole PECL Voltage Controlled Xtal Oscillator
|
ETC[ETC]
|
| ZTA-MG ZTA-MT ZTA-MX |
2 Pad and 3 Pad Ceramic Package, 5.5 mm x 10 mm
|
ILSI America LLC
|
| CDR11BP100AGYS CDR11BP101AGYS CDR11BP102AGYS CDR11 |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.00001 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0001 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.001 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.00075 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.000075 uF, SURFACE MOUNT CHIP
CAP 2200PF 50V 5% X7R SMD-1111 WAFFLE-PAK BASE/BARR/SOLDER MICROWAVE R-MIL-PRF-55681 CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0022 uF, SURFACE MOUNT
|
AVX, Corp.
|
| HMPP-3862-TR2 |
50 V, SILICON, PIN DIODE LEADLESS, CERAMIC, ULTRA MINIATURE, 1412, MINIPAK-4
|
Vishay Intertechnology, Inc.
|
| ILCX20-FJ0F18-20.000 ILCX20-FJ2F18-20.000 ILCX20-F |
4 Pad Ceramic Package Quartz Crystal, 1.2 mm x 1.6 mm
|
ILSI America LLC
|
| ILCX09-GI1F18-20.000 ILCX09-HF3F18-20.000 ILCX09-B |
2 Pad Ceramic Package Quartz Crystal, 3.5 mm x 6 mm
|
ILSI America LLC
|
| SLCC |
Leadless Chip Carrier 16-24 Terminal
|
Vishay
|
| YGUR302TM |
Surface-mounted and leadless chip LED device
|
Seoul Semiconductor
|
| CSPTVH-74.250 |
CRYSTAL OSCILLATOR, CLOCK, 74.25 MHz, PECL OUTPUT ROHS COMPLIANT, MINIATURE, LEADLESS, CERAMIC, SMD, 6 PIN
|
Raltron Electronics, Corp.
|
|
