| PART |
Description |
Maker |
| 0314032200 |
2.54mm (.100) MX64 Sealed Single Row Crimp Housing, MX64 Terminal, Black2 Circuits, Mating Part: Keying B, Lock None
|
Molex Electronics Ltd.
|
| 31402-3100 |
2.54mm MX64 Sealed Single Row Crimp Housing
|
Molex Electronics Ltd.
|
| 31402-2400 CVP31402-2400 |
2.54mm MX64 Sealed Single Row Crimp Housing
|
Molex Electronics Ltd.
|
| 33467-0004 0334670004 |
2.54mm (.100) Pitch MX64 Terminal, Gold (Au) Plating, 22 AWG, Left Reel PayoffAlso used with MX123 Female Receptacle Housing
|
Molex Electronics Ltd.
|
| 87874-3001 0878743001 |
5.08mm (.200), 2.54mm (.100) Pitch Power, 2.54mm (.100) Pitch Signal, EXTreme PowerPlus Pa-S Header, Through Hole, Right Angle, Screw Mount
|
Molex Electronics Ltd.
|
| HCPL-576X 5962-8947701 5962-8947701PA 5962-8947701 |
Hermetically Sealed Optocoupler. AC/DC to Logic Interface 密封光耦AC / DC的逻辑接口
AC/DC to Logic Interface Hermetically Sealed Optocouplers
5962-8947701YA · Hermetically sealed Optocoupler, AC/DC to Logic Interface
5962-8947702KPA · Hermetically sealed Optocoupler, AC/DC to Logic Interface
5962-8947701XA · Hermetically sealed Optocoupler, AC/DC to Logic Interface
5962-8947701YC · Hermetically sealed Optocoupler, AC/DC to Logic Interface
5962-8947701PC · Hermetically sealed Optocoupler, AC/DC to Logic Interface
5962-8947701PA · Hermetically sealed Optocoupler, AC/DC to Logic Interface
HCPL-576K-100 · Hermetically Sealed Optocoupler, AC/DC to Logic Interface
5962-8947702KPC · Hermetically sealed Optocoupler, AC/DC to Logic Interface
5962-8947702KXA · Hermetically sealed Optocoupler, AC/DC to Logic Interface
5962-8947702KYA · Hermetically sealed Optocoupler, AC/DC to Logic Interface
5962-8947702KYC · Hermetically sealed Optocoupler, AC/DC to Logic Interface
HCPL-5760 · Hermetically Sealed Optocoupler, AC/DC to Logic Interface
HCPL-576K · Hermetically sealed Optocoupler, AC/DC to Logic Interface
|
International Rectifier, Corp.
Avago Technologies, Ltd.
HP[Agilent(Hewlett-Packard)]
Agilent (Hewlett-Packard)
|
| CYM1828HG-25C |
32K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CPGA66 1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66
|
Intersil, Corp.
|
| 0310731071 31073-1071 |
2.54mm (.100) H-DAC 64
2.54mm (.100") H-DAC 64垄芒
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0942460012 |
2.54mm (.100) Pitch, MOX Header, 2.54mm (.100) Grid, Through Hole
2.54mm (.100") Pitch, MOX Header, 2.54mm (.100") Grid, Through Hole
|
Molex Electronics Ltd.
|
| ZTX653DCSM ZTX753DCSM ZTX653DCSM02 ZTX653/753DCSMG |
2000 mA, 100 V, 2 CHANNEL, NPN AND PNP, Si, SMALL SIGNAL TRANSISTOR HERMETIC SEALED, CERAMIC, LCC2-6
NPN/PNP DUAL TRANSISTOR IN A HERMETICALLY SEALED CERAMIC SURFACE MOUNT PACKAGE FOR HIGH RELIABILITY APPLICTIONS
|
TT electronics Semelab, Ltd.
Seme LAB
http://
|
| 22-14-2214 0022142214 A-4455-BH21D |
2.54mm (.100) Pitch KK? PC Board Connector, Bottom Entry, 2.54μm (100μ) Tin (Sn), 21 Circuits
2.54mm (.100) Pitch KK庐 PC Board Connector, Bottom Entry, 2.54渭m (100渭) Tin (Sn), 21 Circuits
2.54mm (.100) Pitch KK垄莽 PC Board Connector, Bottom Entry, 2.54楼矛m (100楼矛) Tin (Sn), 21 Circuits
|
Molex Electronics Ltd.
|
|
